Central Glass Company, Limited

International Business Machines Corporation

Central Class Co., Ltd.

Yoshiharu Terui

Daniel Sanders

Masaki Fujiwara

Haruhiko Komoriya

Soichi Kumon

Yuki Fukui

Yuzo Okumura

James L Hedrick

Manabu Yasumoto

Yukari Hara

Fumito Kobayashi

Ikunari Hara

Takashi Kume

Shuhei Yamada

Susumu Inoue

Katsuya Kondo

Takashi Mori

Saori Shiota

A bevel portion treatment agent composition of the present invention is a bevel portion treatment agent composition containing a silylating agent, which is used for treating a bevel portion of a wafer, in which a surface modification index Y and a surface modification index Z measured by a predetermined procedure have a characteristic of satisfying 0.5&#x2264;Y/Z&#x2264;1.0.

Bevel portion treatment agent composition and method of manufacturing wafer

According to the present disclosure, there are provided a surface treatment agent having the advantage that the raw material components can be dissolved in a short time during preparation of the surface treatment agent and capable of exerting a good water repellency imparting effect, and a method of manufacturing a surface-treated body with the use of the surface treatment agent. The surface treatment agent according to the present disclosure includes the following components: (I) at least one kind selected from the group consisting of silicon compounds represented by the following general formulas [1], [2] and [3]; (II) at least one kind selected from the group consisting of a nitrogen-containing heterocyclic compound represented by the following general formula [4], a nitrogen-containing heterocyclic compound represented by the following general formula [5], and imidazole; and (III) an organic solvent. 

Surface treatment agent and surface-treated body manufacturing method

A surface treatment method of a Si element-containing wafer including, during a cleaning process of the wafer, forming a water-repellent protective film on at least the recess portion of the uneven pattern by supplying a vapor of a composition containing a water-repellent protective film-forming component and a solvent in a state that a liquid is retained in at least the recess portion of the uneven pattern, changing the vapor of the composition into a liquid and replacing the liquid retained in the recess portion with the liquid of the composition. The water-repellent protective film-forming component consists of a compound of formula [1], and the solvent contains at least an acyclic carbonate.R(CH)SiN(R)&#x2003;&#x2003;[1]Ris selected from the group consisting of a H and a C-Chydrocarbon group; x is an integer of 1 to 3; and Ris each independently a group selected from the group consisting of methyl, ethyl and acetyl.

Surface treatment method of wafer and composition used for said method

According to the present disclosure, there is provided a water-repellent protective film-forming liquid chemical capable of achieving an improved water repellency imparting effect. The water-repellent protective film-forming liquid chemical according to the present disclosure contains the following compositions: (I) an aminosilane composition of the following general formula [1]; (II) a silicon compound of the following general formula [2]; and (III) an aprotic solvent, wherein the amount of the component (I) contained is 0.02 to 0.5 mass % based on the total amount of the components (I) to (III).(R)Si(H)(NH)&#x2003;&#x2003;[1](R)Si(H)X&#x2003;&#x2003;[2]

Chemical agent for forming water repellent protective film and surface treatment method for wafers

A film-forming composition according to the present invention includes: a fluororesin having a repeating unit of the formula (1) and a repeating unit of the general formula (2); and a fluorine-containing solvent. In the general formula (2), Rrepresents a C-Cstraight, C-Cbranched or C-Ccyclic hydrocarbon group in which at least one hydrogen atom may be replaced by a fluorine atom or chlorine atom and which may have a hydroxy group. This film-forming composition is suitably usable for the manufacturing of an organic semiconductor element as the composition can form a fluororesin film on an organic semiconductor film; and the formed film has resistance to an etching solvent during the fine pattern processing of the organic semiconductor film by photolithography etc.

Composition for forming films, film produced from said composition, and method for producing organic semiconductor element using said composition

A film-forming composition according to the present invention include fluororesin having a repeating unit of the general formula (1); and a fluorine-containing solvent. In the general formula (1), Reach independently represents a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group; and Reach independently represents C-Cstraight, C-Cbranched or C-Ccyclic fluorine-containing hydrocarbon gr which any hydrogen atom may be replaced by a fluorine atom with the proviso that the repeating unit contains at least one fluorine atom. This film-forming composition is suitably usable for the manufacturing of an organic semiconductor element because the composition can form a film on an organic semiconductor film; and the formed film has resistance to an etching solvent during the fine pattern processing of the organic semiconductor film by photolithography etc.

Film-forming composition, film formed thereby, and method for manufacturing organic semiconductor element using same

Provided are sulfonamide-containing compositions, topcoat polymers, and additive polymers for use in lithographic processes that have improved static receding water contact angles over those known in the art. The sulfonamide-containing topcoat polymers and additive polymers of the present invention include sulfonamide-substituted repeat units with branched linking group as shown in Formula (I): 

Sulfonamide-containing topcoat and photoresist additive compositions and methods of use

A positive-type resist composition according to the present invention includes a fluorine-containing aliphatic alcohol, a polymer, a vinyl compound and a photoacid generator, wherein the fluorine-containing aliphatic alcohol is a monohydric C-Caliphatic alcohol in which the number of hydrogen atoms is equal to or less than the number of fluorine atoms. This positive-type resist composition has a small influence on organic materials, such as less dissolution and swelling of the organic materials, and can form a resist film on an organic polymer substrate etc. by a wet application process such that the resulting resist film or resist pattern shows high solvent resistance.

Positive-type resist composition

Provided are sulfonamide-containing photoresist compositions for use in lithographic processes that have improved properties for high resolution, low blur imaging. Also provided are alcohol-soluble photoresists for resist-on-resist applications. The sulfonamide-containing photoresist compositions of the present invention include positive-tone photoresist compositions that have sulfonamide-substituted repeat units with branched linking group as shown in Formula (I): 

Sulfonamide-containing photoresist compositions and methods of use

A fluorine-containing polymer has a repeating unit of the general formula (2) and is produced by homopolymerization or copolymerization with another polymerizable double bond-containing monomer. In general formula (2), W represents a linking group; Reach independently represents a perfluoroalkyl group; Q represents a unit structure formed by cleavage of a double bond of a polymerizable double bond-containing group; and Mrepresents a hydrogen cation, a metal ion or a quaternary ammonium ion.

Fluorine-containing polymer and anti-static agent wherein same is used

A one pot method of preparing cyclic carbonyl compounds comprising an active pendant pentafluorophenyl ester group is disclosed. The cyclic carbonyl compounds can be polymerized by ring opening methods to form ROP polymers comprising repeat units comprising a side chain pentafluorophenyl ester group. Using a suitable nucleophile, the pendant pentafluorophenyl ester group can be selectively transformed into a variety of other functional groups before or after the ring opening polymerization.

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San Jose, CA, United States of America

Yoshiharu Terui