Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Panasonic Electric Works Co., Ltd.

Yoshiharu Sanagawa

Takanori Aketa

Masao Kirihara

Mitsuhiko Ueda

Shintaro Hayashi

Nobuhiro Ide

Takafumi Okudo

Yushi Nakamura

Takahiro Miyatake

Yoichi Nishijima

Ryo Tomoida

Hirofumi Kubota

Kazuyuki Yamae

Yoshikazu Kuzuoka

Tsutomu Ichihara

Hiroshi Yamanaka

Koji Tsuji

Takaaki Yoshihara

Kazuo Gouda

Takanori Sugiyama

Yuko Suzuka

Hitomichi Takano

Toshihiko Sato

Youichi Nishijima

Masuyuki Ota

Takami Okubayashi

An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.

Infrared sensor

The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.

Light emitting device and method for manufacturing same

An infrared sensor includes: an infrared detecting device; a lens disposed above the infrared detecting device; an member that is disposed at a side of an upper surface of the lens and includes an opening; and a gap that intervenes between the member and the lens and has a wider range than the opening.

A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.

Mounting method

The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.

IR sensor package including a cover member and a sensor chip recessed into the package body

A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.

Light emitting module

The organic electroluminescent element has a transparent substrate, a transparent first electrode, an organic layer, a second electrode, and a light-outcoupling layer. The light-outcoupling layer is formed between the transparent substrate and the first electrode. The first electrode, the organic layer and the second electrode constitute an electroluminescent laminate. A covering substrate facing the transparent substrate is adhered to the surface of the transparent substrate via an adhesive sealing portion surrounding the periphery of the electroluminescent laminate. A connection electrode extending outward from inside a surrounded region where the electroluminescent laminate is covered with the covering substrate is formed at least on the surface of the light-outcoupling layer. The average thickness of the light-outcoupling layer in an adhesion region where the adhesive sealing portion is formed is smaller than the thickness in the central region where the electroluminescent laminate is formed.

Organic electroluminescent element

A composite substrate includes a moisture-proof substrate, and a resin substrate pasted on a surface of the moisture-proof substrate. The resin substrate is formed to be smaller than the moisture-proof substrate in planar view. An end side of the resin substrate is an inclined face that is inclined inward. In an organic electroluminescence device, an organic light-emitting multilayer provided on a surface of the resin substrate is sealed with a sealing member. A moisture-proof film coats at least part of the surface of the resin substrate in which no lead-out electrode is formed.

Composite substrate, manufacturing method of the same and organic electroluminescence device

An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.

Infrared sensor module

A sensor system includes a sensor device () and an integrated circuit () for driving the device (). The device () includes a sensor body () of a silicon-based material, an upper sealing member () of a silicon-based material, and a lower sealing member () of a silicon-based material. The upper sealing member () and the lower sealing member () are joined together to cooperatively house the body () therewithin in an airtight manner. The device () and the circuit () are formed as a stacked body. The body () is electrically connected to a wiring pattern () of the circuit () through a conductive through-path () penetrating the upper sealing member () and a mounting electrode () provided on an outer surface of the upper sealing member (). The device () is connected to an MID substrate () through the circuit ().

Growing community of inventors

Osaka, Japan

Yoshiharu Sanagawa