Denso Corporation

Nippondenso Co., Ltd.

Other

Yoshifumi Watanabe

Yukihiro Kato

Takashi Aoki

Takashi Nomura

Tokio Kohama

Hiroaki Tanaka

Hiroshi Okada

Kiyohiko Watanabe

Osamu Ito

Hironobu Baba

Yasuyuki Kawabe

Osamu Ina

Hiroyuki Okada

Manabu Tomisaka

Masato Ueno

Kouji Hashimoto

Seiichirou Otake

Iwao Yokomori

Kazuaki Fujisawa

A second case includes a projection that projects on an opposite side of a threaded portion of the second case, which is opposite from a first case, while the projection is placed in a passage when the second case is installed to an installation-subject member. An opening is formed in a visible area of an outer peripheral surface of the projection, which is visible at a time of viewing the outer peripheral surface in a flow direction of the measurement-subject medium upon installation of the second case to the installation-subject member, and the projection includes a flow direction changing portion that changes a flow direction of the measurement-subject medium, which is introduced from the passage into an introducing hole through the opening, from a direction along the passage to a direction toward the sensor unit.

Temperature sensor and mounting structure for same

A pressure sensor is provided, which includes a case, a sensing chip located in the case for detecting pressure, and a protective material for covering and protecting the sensing chip in the case. Corners of the case, which are in contact with the protective material are each formed into a rounded shape. A curvature radius of each of the corners is adapted to be 0.5 mm or more.

Pressure sensor with sensing chip protected by protective material

A method for manufacturing a pressure sensor includes the steps of: preparing a semiconductor substrate; forming an insulation film on the substrate; forming a first metal film on the insulation film; forming a first protection film on the first metal film and the insulation film; forming a second protection film on the first metal film and the first protection film; performing reduction treatment of adhesive force on the second protection film, the force between the second protection film and a second metal film; forming the second metal film on the first metal film and the first protection film; and removing a part of the second metal film.

Method for manufacturing pressure sensor

A humidity sensor includes a resin molding body having a wall portion as a barrage, a chip having at least a humidity sensing function and fixed to a portion of the resin molding body inside the wall portion, and a terminal conductor insert-molded in the resin molding body and partially leaded to an exterior of the resin molding body. Here, the terminal conductor is electrically connected to the chip inside the wall portion of the resin molding body. In the humidity sensor, a protecting material having a humidity sensing property is filled in the wall portion and covers an entire electric connecting portion of the chip and the terminal conductor. The structure of the humidity sensor can be suitably used for a composite sensor including a chip having a humidity sensing function.

Humidity sensor and composite sensor having humidity detecting function

A first body is bonded with a second body to accommodate a sensor element therein. An annular convexity is formed at either the first body or the second body along with its peripheral end border. On the other of the first body and the second body, an annular concavity is formed to engage with the convexity. The convexity engages with the concavity to form an inner gap and an outer gap. Glue is filled in the inner gap and the outer gap. The peripheral surface of the convexity and the peripheral surface of the concavity, where the glue is bonded, have plural protrusions.

Bonding structure having protrusions

A pressure detecting apparatus having a pressure introducing pipe is installed on an intake surge tank for detecting inner pressure in the intake surge tank. The intake surge tank is provided with a throttle passage having a throttle is disposed in the intake surge tank along a flow direction of the gas for increasing a flow speed of the gas. A pressure inlet at a leading end of the pressure introducing pipe is positioned in a vicinity of the throttle.

Pressure detecting apparatus and installation structure of same

A sensor device has a semiconductor sensor chip mounted on a resin package with which insert pins are insert-molded. The sensor chip and the pins are electrically connected to each other by bonding wires. An electrically insulating protective member covers the chip, the pins, and the wires. The protective member has a saturated swelling coefficient of approximately 7 wt % at most when the protective member is immersed into gasoline having a temperature of 20&deg; C. Accordingly, bubbles are prevented from being produced in the protective member.

Semiconductor pressure sensor device having sensor chip covered with protective member

A semiconductor pressure sensor chip is mounted on a recess of a resin package, and is electrically connected to bonding pads on the bottom of the recess through bonding wires. The recess is filled with a first protective member having a relatively large Young's modulus and a second protective member having a relatively small Young's modulus. The first protective member covers the bonding pads, and the second protective member is disposed on the first protective member and covers a diaphragm of the sensor chip. Accordingly, voids are prevented from being produced without preventing displacement of the diaphragm.

Semiconductor pressure sensor device with multi-layered protective member that reduces void formation

A liquid-sealed type semiconductor pressure sensor with no filling orifice includes a connector housing which is made of high polymer compound material of high air permeability and which has a recess and connector pins, where a main housing which has a sealing diaphragm is secured to the connector housing airtightly and a pressure sensitive element is disposed in the recess and is electrically connected to external circuitry by connector pins. A pressure detecting chamber formed between the recess and the sealing diaphragm is filled with pressure transmitting medium, such as silicone oil, having high air solubility. To manufacture the sensor, the recess is filled with a fixed volume of the pressure transmitting medium, the main housing is placed on the connector housing, and a prescribed pressure is applied to the sensor to dissolve air trapped in the pressure detecting chamber during the previous step into the transmitting medium and to purge the rest through the high polymer compound materials used in the connector housing. As a result, a non-linear pressure rise in the pressure detecting chamber can be prevented.

Liquid-sealed semiconductor pressure sensor and manufacturing method

A semiconductor pressure transducer comprises a metal housing having a cylindrical recess to which an inlet passage of a medium to be measured is opened, a glass base being received in the recess and having a large diameter cylindrical portion and a small diameter cylindrical portion integrally connected to the large diameter cylindrical portion, a rubber O-ring interposed between a bottom of the recess and the base, a metal tubular collar disposed in the recess around the base to come into contact with the bottom of the recess, the collar urged by a caulked portion of the housing to press the base, a sensor chip provided on an end of the small diameter cylinder of the base for generating an electric signal in response to pressure of said medium, an annular clearance provided between the collar and the base, and an introducing passage provided in the base for introducing the medium from the inlet passage to the sensor chip.

Growing community of inventors

Kariya, Japan

Yoshifumi Watanabe