Murata Manufacturing Co., Ltd.

Yoshifumi Takahashi

Hiroshi Okabe

Shingo Yanagihara

Tsutomu Kobori

Shigeru Yoshida

A power amplifier device includes a semiconductor substrate; a plurality of first transistors that are provided on the semiconductor substrate and receive input of a radio-frequency signal; a plurality of second transistors that are provided on the semiconductor substrate and electrically connected to the respective plurality of first transistors, and output a radio-frequency output signal obtained by amplifying the radio-frequency signal; a plurality of first bumps provided so as to overlay the respective plurality of first transistors; and a second bump provided away from the plurality of first bumps and provided so as not to overlay the plurality of first transistors and the plurality of second transistors. When viewed in plan from a direction perpendicular to a surface of the semiconductor substrate, a first transistor and a first bump, a second transistor, the second bump, a second transistor, and a first transistor and a first bump are arranged in sequence.

Power amplifier device

A power amplifier circuit includes an amplifier unit disposed on a die of a semiconductor device. The amplifier unit includes an amplifier transistor. The power amplifier circuit further includes a detector transistor disposed on the die of the semiconductor device, a variable attenuator that compensates for a gain of the amplifier unit, a bias level setting holding unit that holds a bias level setting value, which is set based on at least a detection value of the detector transistor, and a bias generation unit that generates a bias value of the variable attenuator based on the bias level setting value.

Power amplifier circuit, semiconductor device, and method for manufacturing semiconductor device

A ground pad is disposed on a substrate. A plurality of transistors, each grounded at an emitter thereof, are in a first direction on a surface of the substrate. An input line connected to bases of the transistors is on the substrate. At least two shunt inductors are each connected at one end thereof to the input line and connected at the other end thereof to the ground pad. In the first direction, the two shunt inductors are on opposite sides of a center of a region where the transistors are arranged.

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Kyoto, Japan

Yoshifumi Takahashi