Nitto-denko Corporation

Yoshifumi Shinogi

Toshiki Naito

Daisuke Uenda

Takeshi Yamato

A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive patternon a surface of the elongate substrateby the semi-additive process using electrolysis plating and then annealing the elongate substratewith the conductive patternin its wound up state, a stiffener sheethaving a width narrower than the elongate substrateis bonded to the back side of the elongate substrateThereafter, an oxidized film formed on a surface of the conductive patternis removed and then a solder resistis formed thereon. This prevents the strip of the stiffener sheetfrom the elongate substrateand in turn prevents etching solution or developing solution from entraining in a gap therebetween.

Producing method of flexible wired circuit board

A method for manufacturing a double-sided circuit board from a board material having a first electric conductor layer and a first electrically insulating layer, including the steps of: making conduction holes in the board material so as to penetrate only the first electrically insulating layer or both the first electrically insulating layer and the first electric conductor layer; forming an electrically conductive thin-film layer on a surface of the first electrically insulating layer and wall surfaces of the conduction holes; forming a second electrically insulating layer on the electrically conductive thin-film layer; forming a first electric conductor wiring by electroplating on predetermined portions of the electrically conductive thin-film layer; covering the first electric conductor wiring with a chemical-resistant film; forming a second electric conductor wiring by chemically dissolving a predetermined portion of another surface of the first electric conductor layer; and removing the second electrically insulating layer and the film.

Growing community of inventors

Osaka, Japan

Yoshifumi Shinogi