Sumitomo Electric Industries, Limited

Sumitomo Wiring Systems, Limited

Autonetworks Technologies, Limited

Yoshifumi Saka

Akihiro Kato

Hajime Watanabe

Takahiro Sunaga

Yasushi Saitoh

Mitsuhiro Kumondai

Masayuki Ookubo

Ryota Mizutani

Kingo Furukawa

Shigeru Sawada

Mikio Satou

Yasushi Saitou

Michitake Kamamoto

Mikio Sato

A PCB terminal is provided with a rod-like base material and a plating layer covering a predetermined region of the base material. A constituent material of the base material is a copper alloy containing 20% by mass or more of zinc. The plating layer includes a first coating portion and a second coating portion. The first coating portion includes an entire peripheral layer entirely covering a region on side of a first end part, out of both end parts of the base material, in a circumferential direction of the base material. The second coating portion partially covers a region on side of a second end part, out of the both end parts of the base material, in the circumferential direction of the base material. The entire peripheral layer includes a tin-based layer and a barrier layer.

PCB terminal, connector, wiring harness with connector and board unit

A pin terminal includes a bar-like base material and a plating layer covering a predetermined region of the base material. A constituent material of the base material is pure copper or a copper alloy. The plating layer includes a tin-based layer made of metal containing tin. One end side of the base material includes a tip covering portion. The tin-based layer includes the tip covering portion. The tip covering portion covers an entire region in a circumferential direction on the one end side of the base material. A difference (t−t) between a maximum value tand a minimum value tof a thickness of the tip covering portion measured at a measurement location set at a spot of 1 mm from one end of the pin terminal along a longitudinal direction of the pin terminal is 0.20 μm or more.

Pin terminal, connector, wiring harness with connector and control unit

A pin terminal includes a bar-like base material and a plating layer covering a predetermined region of the base material. A constituent material of the base material is pure copper or a copper alloy. The plating layer includes a tin-based layer made of metal containing tin. One end side of the base material includes a tip covering portion covering an entire region in a circumferential direction of the base material. The tin-based layer includes the tip covering portion. The tip covering portion includes a thin film portion and a thick film portion at positions different in the circumferential direction of the base material. The thin film portion is provided in contact with the base material. The number of whiskers present on a surface of the thin film portion is 15 or less in a square visual field having one side length of 0.35 mm.

A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.

Metallic material and connection terminal

A metallic material that includes a foundation material; and a surface layer formed on a surface of the foundation material and exposed on an outermost surface, wherein the surface layer contains a precious metal element made of at least one kind selected from the group consisting of Ag, Au, and a platinum group element, and In, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the foundation material, at least in a contact portion electrically contacting an opposite electrically conductive member.

A terminal fitting that can reduce the terminal insertion force and can suppress surface oxidation of a plating film, even if the terminal fitting is exposed to a hot and humid environment, and a connector that uses the terminal fitting. The terminal fitting includes a metal base material, and the plating film. The plating film includes a Ni foundation layer, an outermost layer exposed at the outermost surface, and a NiSnlayer formed between the Ni foundation layer and the outermost layer. The outermost layer includes a Sn parent phase, and intermetallic compound that is dispersed in the Sn parent phase, and is made of (NiPd)Sn. The intermetallic compound protrudes from the lower side of the outermost layer to the NiSnlayer side, and is partially buried in the NiSnlayer. A connector includes the terminal fitting, and a housing that holds the terminal fitting.

Terminal fitting and connector

A board terminalincludes a base materialmade of a metal material and a plating filmcovering a surface of the base materialThe plating filmincludes an outermost layerhaving a Sn mother phaseand Sn&#x2014;Pd-based alloy phasesdispersed in the Sn mother phasethe Sn mother phaseand the Sn&#x2014;Pd-based alloy phasesbeing present on an outer surface. A Pd content in the outermost layeris not more than 7 atomic %. A board connectorincludes the board terminaland a housingfor holding the board terminal

Board terminal and board connector

A terminal pair including a first terminal provided with a first contact portion and a second terminal provided with a second contact portion. The first contact portion includes a composite covering layer having a Sn&#x2014;Pd based alloy phase and a Sn phase, and has a surface including the Sn&#x2014;Pd based alloy phase and the Sn phase. The second contact portion includes a Cu&#x2014;Sn alloy layer and a Sn layer covering part of the Cu&#x2014;Sn alloy layer, and has a surface including a Cu&#x2014;Sn alloy region corresponding to an exposed portion of the Cu&#x2014;Sn alloy layer and a Sn region corresponding to an exposed portion of the Sn layer. A coefficient of friction for sliding movement between the first contact portion and the second contact portion is lower than a coefficient of friction for sliding movement between the two first contact portions and between the two second contact portions.

Terminal pair and connector pair including terminal pair

An electric contact pair includes a first electric contact, and a second electric contact to be brought into electrical contact with the first electric contact. The first electric contact includes a first plating film made of Ag or a Ag alloy on its outermost surface, and the second electric contact includes a second plating film made of Rh or a Rh alloy on its outermost surface. The first plating film maybe layered on a first conductive base material, the second plating film maybe layered on a second conductive base material, and the first conductive base material and the second conductive base material are made of copper or a copper alloy, or aluminum or an aluminum alloy. A connector terminal pair includes a first terminal including the first electric contact, and a second terminal including the second electric contact.

Connector terminal pair

A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn&#x2014;Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn&#x2014;Pd based particles are present. Further, the number of the Sn&#x2014;Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn&#x2014;Pd based particles per 500 &#x3bc;m.

It is aimed to provide a plated member and a plated terminal for connector, to which a large current can be applied and which have both a low friction coefficient and high heat resistance, at low cost and provide a method for producing such a plated member and a method for producing such a plated terminal for connector. A silver-tin alloy layer for coating a surface of a base material made of copper or copper alloy and a silver coating layer for coating the silver-tin alloy layer and to be exposed on an outermost surface are simultaneously formed by heating to obtain a plated member after tin and silver plating layers are alternately laminated on the surface of the base material with the outermost surface formed by the silver plating layer.

Plated member and plated terminal for connector

An electric contact includes a bulge-shaped contact having a bulge shape, and a plate-shaped contact that has a plate shape and comes into electrical contact with an apex portion of the bulge-shaped contact. The bulge-shaped contact has a silver-tin alloy layer and a silver coating layer that coats the surface of the silver-tin alloy layer and is exposed at an outermost surface. The plate-shaped contact has a silver layer that does not have a silver-tin alloy layer directly below and is exposed at the outermost surface. Also, a connector terminal pair has such an electric contact in a contacting portion.

Electric contact and connector terminal pair

The present invention aims to provide a plated terminal for connector which requires a smaller insertion force by reducing a friction coefficient and a terminal pair formed using such a plated terminal for connector. An alloy containing layer () made of tin and palladium and containing a tin-palladium alloy is formed on a surface of a terminal base material () made of copper or copper alloy. Here, the alloy containing layer () is preferably such that domain structures of a first metal phase () made of an alloy of tin and palladium are formed in a second metal phase () made of pure tin or an alloy having a higher ratio of tin to palladium than in the first metal phase ().

Plated terminal for connector and terminal pair

It is aimed to provide a connector terminal including a silver layer on a surface of an electrical contact portion, having a reduced coefficient of friction of a surface and excellent in practicality and productivity and provide a method for producing such a connector terminal. A coating layer made of a silver layer and a film formed by bringing the silver layer into contact with a solution containing thiol and benzotriazole is formed on a contact portion of a connector terminal to be electrically brought into contact with another electrically conductive member. A solvent of this solution is preferably water and the thiol is preferably octadecanethiol.

Growing community of inventors

Yokkaichi, Japan

Yoshifumi Saka