Murata Manufacturing Co., Ltd.

Yoshifumi Saito

Hiroaki Kaida

Masahiro Kimura

Yuichiro Nagamine

Kazuhiro Mimura

Manabu Ibayashi

Katsuma Moroishi

Takuya Kono

Hiromichi Kawakami

Toru Meguro

Ryuichiro Wada

Toshiyuki Yasugi

A capacitor that includes a conductive metal substrate having a high porosity portion and a low porosity portion with a porosity lower than that of the high porosity portion; a dielectric layer on the conductive metal substrate; an upper electrode on the dielectric layer; an upper extended electrode on one principal face of the conductive metal substrate and electrically connected to the upper electrode; a lower extended electrode on the other principal face of the conductive metal substrate and electrically connected to the conductive metal substrate; and insulating layer on the upper electrode at a position overlapping with the low porosity portion through the dielectric layer and the upper electrode.

Capacitor and method for manufacturing capacitor

A method capable of manufacturing a quartz vibrator by disposing a metallic bonding material on one main surface of a ceramic plate having a quartz vibrating element mounted thereon. Thereafter, the bonding of a cap having a recess to the ceramic plate by disposing the cap on the one main surface of the ceramic plate so that an open side of the recess faces the ceramic plate, melting the bonding material, and then allowing the bonding material to set, is carried out.

Quartz vibrator manufacturing method and quartz vibrator

A crystal resonation device that includes a base plate, a cap, a joining material, and a crystal resonator. The cap is provided on the base plate. The cap forms a sealed space with the base plate. The joining material joins the base plate and the cap. The joining material contains a cured material of thermosetting resin. The crystal resonator is provided on the base plate in the sealed space. The joining material is located in an outer side portion of a wall of the cap joined to the joining material.

Crystal resonation device and production method therefor

A quartz vibrator that includes a substrate, a quartz vibrating element, and a dome-shaped cap. The quartz vibrating element is mounted on the substrate. The cap is bonded to the substrate. The cap defines and forms a sealed space that seals the quartz vibrating element along with the substrate. The cap has a side wall portion, a ceiling portion, and a connecting portion. The side wall portion encloses the quartz vibrating element. The ceiling portion is positioned above the quartz vibrating element. The connecting portion connects the side wall portion and the ceiling portion. The connecting portion is thinner than the side wall portion and the ceiling portion.

Quartz vibrator having a dome-shaped cap

In the manufacture of a multilayer ceramic substrate including a ceramic laminate by a so-called non-shrink process in which the ceramic laminate disposed between shrinkage control layers is fired, first and second surface conductive films formed on first and second main surfaces of the ceramic laminate may cause warping of the multilayer ceramic substrate after the shrinkage control layers are removed. After the firing step, in removing the shrinkage control layers from a composite laminate, the thickness of at least one of first and second reaction layers formed at interfaces between ceramic green layers and the shrinkage control layers in the firing step is reduced such that the thickness of the first reaction layer is different from the thickness of the second reaction layer, thereby controlling the compressive stress generated by the reaction layers to reduce the warping of the multilayer ceramic substrate.

Multilayer ceramic substrate, method for manufacturing the same, and method for reducing substrate warping

A multilayer electronic component including a resin layer disposed on a mounting board side is mounted on a mounting board, and has a structure such that, even when deformation, such as deflection and strain, occurs, a stress on the multilayer electronic component is relieved. In the multilayer electronic component, ends of columnar conductors protrude from a main surface of a resin layer facing the outside. The multilayer electronic component is mounted on a mounting board, and the ends of the columnar conductors are electrically connected to conductive lands. In this case, a predetermined gap is formed between the multilayer electronic component and the mounting board.

Multilayer electronic component, electronic device, and method for producing multilayer electronic component

A ceramic substrate includes a glass layer partially overlaying a conductor, and the glass layer has satisfactory adhesion to the main body of the ceramic substrate and having satisfactory plating resistance. The glass layer is arranged to extend from a portion of the conductor formed on a first main surface of the main body of the ceramic substrate to the first main surface of the main body of the ceramic substrate and which has a double-layered structure including a first glass sublayer composed of a first glass material, and a second glass sublayer formed on the first glass sublayer and composed of a second glass material that is different from the second glass material defining the first glass sublayer, the first glass material having more satisfactory adhesion to the main body of the ceramic substrate than the second glass material, and the first glass material having more satisfactory plating resistance than the first glass material.

Ceramic substrate, electronic apparatus, and method for producing ceramic substrate

A multilayer electronic component having a ceramic substrate and a resin layer mounted on a mounting substrate. Recess portions are formed at an outside-facing major surface side of the resin layer. In the resin layer, columnar conductors are disposed so that axis line directions thereof are aligned in a thickness direction of the resin layer. End portions of the columnar conductors are located inside the recess portions further from opening faces thereof and have end surfaces exposed in the recess portions. When a multilayer electronic component is mounted on a mounting substrate, solder is provided on the end surfaces of the columnar conductors in the recess portions. The thickness of solder used in the above mounting does not interfere with a reduction in size and height of an electronic device that includes the above multilayer electronic component.

Multilayer electronic component, electronic device, and method for manufacturing multilayer electronic component

A composite laminate, including shrink-prevention ceramic green sheets arranged on the main surfaces of an unfired ceramic laminate and having a sintering temperature greater than the firing temperature of the unfired ceramic laminate, is fired at a temperature which is greater than the sintering temperature of the unfired ceramic laminate, and which is less than the sintering temperature of the shrink-prevention ceramic green sheet. Thereafter, the shrink-prevention ceramic green sheets are removed in a first removing step of spraying water and compressed gas against the shrink-prevention ceramic green sheets so as to remove a portion thereof that has not reacted with a glass component of the unfired ceramic laminate, and in a second removing step of ceramic powder, spraying water, and compressed air, such that a residual material not removed in the first removing step is removed, and in a third removing step of supersonic-cleaning the ceramic multi-layer substrate after the first and second steps.

Method of producing ceramic multi-layer substrate

To produce a green composite laminate, a green multilayer collective substratecontaining low-temperature sinterable glass ceramic powder as a main ingredient is disposed between first and second shrinkage-restraining layersandcontaining alumina powder as a main ingredient. Groovesare formed on one main surfaceof the green composite laminatesuch as to pass through the first shrinkage-restraining layerand the green multilayer collective substrateand reach the second shrinkage-restraining layer, but not to reach the other main surfaceof the green composite laminate. The green composite laminateprovided with the groovesis sintered under conditions where the low-temperature sinterable glass ceramic powder is sintered and the green first and second shrinkage-restraining layersandare removed to prepare a plurality of ceramic multilayer substrates. This manufacturing method offers ceramic multilayer substrates with a high dimensional accuracy and substantially prevents defective divisions when a multilayer collective substrate is split into a plurality of ceramic multilayer substrates.

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Otsu, Japan

Yoshifumi Saito