Hitachi, Ltd.

Yoshifumi Morioka

Makoto Kogai

Satoshi Ohishi

Katsumi Otani

Kazuo Hara

Toshimitsu Hamada

Kozo Nakahata

The present invention is related to a component and material traceability control apparatus for controlling manufacturing lot identification information of any of a component and material constituting a product manufactured according to a process where a manufacturing apparatus with not less than one component and material reserve unit picks up a needed amount out of the component and material reserved in the component and material reserve unit and manufactures the product, and the component and material traceability control apparatus is equipped with at least a processing unit, a memory unit used as a work area by the processing unit, a manufacturing performance information memory unit, a component and material supply performance information memory unit, and a manufacturing lot trace information memory unit.

Component and material traceability control apparatus, control method, control program, and control program memory medium

A method and apparatus for inspecting a solder joint by an X-ray fluoroscopic image in which an X-ray is irradiated on an object to be inspected located by a specimen stage and having a lead of an electronic part soldered to a substrate to detect an X-ray fluoroscopic image signal, a position of a lead in a tip direction is obtained by a distribution of projection with said X-ray fluoroscopic image signal projected in a lead row direction, a position of a lead in a row direction is obtained by a distribution of projection with said X-ray fluoroscopic image projected in a lead tip direction to extract a position of a solder joint as an object to be inspected, and said X-ray fluoroscopic image is evaluated every solder joint in accordance with the postion information to effect a defect detection.

Method and apparatus for inspection of solder joints by x-ray

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Chiyoda-ku, Japan

Yoshifumi Morioka