Mitsubishi Electric Corporation

Yoshifumi Mizuno

Hirofumi Inoue

Yoshitsugu Hirayama

Daisuke Sasaki

Naoya Hashii

Kohei Ando

Shingo Kitagawa

Noriyuki Fukakusa

Koji Uyama

In a power conversion device, a semiconductor module, a bus bar assembly, and a smoothing capacitor are superposed on a cooler in the stated order from the cooler side. At least one of a cooling column-equipped member, which is at least one of the smoothing capacitor and the bus bar assembly, and the cooler is provided with a cooling column configured to transfer heat of the cooling column-equipped member to the cooler.

Power conversion device

The power conversion device includes a semiconductor module having a connection terminal, a cooler, a control board, a capacitor module, a cover, a case, and a connection busbar. The semiconductor module, the cooler, the control board, and the capacitor module are arranged in an overlapped manner as seen in the direction perpendicular to the top surface of the cooler. The capacitor module has a capacitor cell, a capacitor case, resin, and a capacitor busbar. The capacitor busbar has an inner extending portion, an opening-side extending portion, and an outer extending portion. The connection busbar extends from the connection terminal of the semiconductor module to an outer surface of the outer extending portion and has a part extending in parallel to the extending direction of the outer extending portion. The connection busbar has a capacitor connection portion at an end thereof on the outer extending portion side.

In the case where as a communication means among two or more control circuit boards corresponding to an on-vehicle environment, a wire harness is mounted, space-saving efficiency and assembly efficiency pose problems. When a board-to-board connector is utilized, arrangement of the control circuit boards cannot freely be performed, due to restriction of predetermined specific dimensions. An electric-power conversion apparatus includes a cooling device having a first surface, a second surface opposite to the first surface, and a hole penetrating the first surface and the second surface, a first control circuit board provided at the first surface side, a second control circuit board provided at the second surface side, and a pin header having a mold portion that partially wraps a connection pin penetrating the hole so as to connect the first control circuit board with the second control circuit board and that is fixed to the cooling device.

Electric-power conversion apparatus

Provided is a power conversion device including: power semiconductor elements, a support case, a heat sink, in which a plurality of boss portions are formed; a smoothing capacitor including a case member having a plurality of leg portions; and a bus bar configured to connect the smoothing capacitor and the DC input terminal, wherein, in the power conversion device in which the plurality of leg portions of the case member being respectively fixed to the plurality of boss portions of the heat sink, wherein materials and dimensions of the respective boss portions, the respective leg portions, the support case, and the bus bar are determined so that a total thermal expansion/contraction amount of the respective boss portions and the respective leg portions falls within a range of 0.9 to 1.1 relative to a total thermal expansion/contraction amount of the support case and the bus bar.

Growing community of inventors

Tokyo, Japan

Yoshifumi Mizuno