Fujitsu Corporation

Fujitsu Limied

Fujitsu Isotec Limited

Yoshiaki Yanagida

Tomokazu Sugiyama

Koji Sudo

Shunsuke Sone

Kazuo Yokoi

Koji Suto

Teruaki Nishioka

Motoichi Watanuki

Michinao Nomura

Hirokazu Yamanishi

Mitsuo Takeuchi

Tohru Harada

Masaru Sugie

Chiaki Sekioka

Masayuki Kubota

Hisashi Uemura

Hirobumi Haga

Hiroshi Kobayashi

Hidehiko Kira

Kenji Kobae

Norio Kainuma

Takayoshi Matsumura

Toru Okada

Shuichi Takeuchi

Shinji Hiraoka

Kazuhisa Mishima

Akihiko Ushimaru

Tsutomu Honma

Tsutomu Sooda

An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

Apparatus for mounting electronic component

An electronic component repair method for removing an electronic component soldered on a substrate, the method includes: mounting a heat transfer plate on the electronic component to be removed, the heat transfer plate being formed by bonding a plurality of heat transfer members via a heat insulating member, heating the heat transfer plate mounted on the electronic component by a heating unit, the heating unit heating individually each of the heat transfer members by different heat amount; and removing the electronic component from the substrate after the heating.

Electronic component repair method

Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.

Film sticking device, film sticking method, and electronic paper manufacturing method

A laser processing method includes the steps of: preparing a long metal object to be irradiated; and irradiating the object with a laser beam at a certain portion in a longitudinal direction of the object. The irradiation is performed along a width direction of the object for both a first half path from one end to the other end of the object in the width direction and a return path from the other end to the one end so that the object can be bent.

Laser processing method, laser processing apparatus and spring arm manufacturing method

A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.

Processing method and apparatus

A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support partthat tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic bodycomposed of a plate spring that contacts the movable support part and elastically presses the movable support part.

Slider tester

Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.

Manufacturing method and apparatus for magnetic head sliders

A pad of an embedding tool is received on a faceplate. The pad is supported on a support member. When the embedding tool is urged against the surface of the faceplate, the pad is allowed to change the attitude relative to the support member in response to undulation generated on the surface of the faceplate. The movement of the flat surface follows the undulation of the faceplate. When a relative movement is induced between the embedding tool and the surface of the faceplate, the surface of the faceplate thus reliably receives the uniform or constant contact of the flat surface. When grains are supplied between the flat surface of the pad and the surface of the faceplate, the grains are uniformly pushed into the surface of the faceplate. In this manner, the grains are uniformly and constantly embedded into the surface of the faceplate.

Embedding tool designed to embed grains into faceplate for lapping apparatus

A lapping machine comprises a lapping surface plate () rotated by a rotating mechanism, a lapping jig () having a plurality of projections to bottom surfaces of which a work () to be lapped by a lapping surface on the lapping surface plate () is fitted, amount-of-projection adjusting elements () for adjusting the variation of the plurality of projections () to the lapping surface plate () individually, and a control circuit () for outputting variation-of-projection control signals to the variation-of-projection adjusting elements ().

Lapping machine, lapping method, and method of manufacturing magnetic head

Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.

Method and apparatus for polishing, and lapping jig

An apparatus and a method for polishing a row bar including magnetic head sliders. A lapping surface plate is rotatable, and a housing is movable above the lapping surface plate. A jig is secured to the housing for holding the row bar. The jig is formed by an elongated rigid member having a plurality of holes and an elongated elastic member fixed to the rigid member. An air cylinder presses the whole row bar, and a pressing devices individually presses portions of the elastic member corresponding to magnetic head sliders of the row bar through the holes of the rigid member. A portion of the elastic member is deformed to press a portion of the row bar in response to a change in the measured resistance of ELG resistance elements in the row bar.

Apparatus and method for polishing row bars

A lapping method includes a step of moving a substantially bar-shaped workpiece in a radial direction of a surface of a rotary lapping plate while simultaneously oscillating the workpiece pivotally about a central point in a longitudinal direction of the workpiece in a plane parallel to the surface of the rotary lapping plate.

Lapping method and lapping apparatus

A lapping machine comprises a lapping surface plate ( ) rotated by a rotating mechanism, a lapping jig ( ) having a plurality of projections to bottom surfaces of which a work ( ) to be lapped by a lapping surface on the lapping surface plate ( ) is fitted, amount-of-projection adjusting elements ( ) for adjusting the variation of the plurality of projections ( ) to the lapping surface plate ( ) individually, and a control circuit ( ) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements ( ).

A blade as an edged member having separated two forward ends is inserted into an opening of a holder as a U-shaped member, and a gap between the two forward ends of the inserted blade is widened so that a width of the opening is expanded, and a light guide body as a thin plate is inserted into the opening with expanded width, and after that the two forward ends of the blade are drawn from the opening.

Growing community of inventors

Kawasaki, Japan

Yoshiaki Yanagida