Kyocera Corporation

Fj Composite Materials Co., Ltd.

Yoshiaki Ueda

Shinji Nakamoto

Nobuyuki Tanaka

Eiki Tsushima

Yoshihiro Ushio

Manabu Miyaishi

Kazuhiro Kawabata

Kiyoshige Miyawaki

Tetsurou Abumita

Hiroshi Mizushima

Tsutomu Sugimoto

Atsurou Yoneda

A semiconductor element housing package includes a substrate, a frame body disposed on the substrate; an insulating substrate disposed in a frame-body-surrounded region of the substrate; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate so as to be spaced away from the first mounting member; a first lead member having a first bend; and a second lead member having a second bend. The first lead member is disposed so as to pass through the frame body from an exterior thereof and extend over the first mounting member and makes connection therewith through the first bend. The second lead member is disposed so as to pass through the frame body from the exterior thereof and extend over the second mounting member and makes connection therewith through the second bend.

Semiconductor element housing package and semiconductor device equipped with the same

There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

Substrate for mounting device and package for housing device employing the same

A structure includes a circuit substrate including a first substrate and a second substrate. The first substrate has a region where an electronic component is to be mounted. The second substrate has a side surface connected to a first side surface of the first substrate. The structure further includes a frame on the circuit substrate, enclosing the region in a plane view. The frame crosses the boundary between the first substrate and the second substrate.

Structure and electronics device using the structure

An electronic-component-housing package comprises a container including a rectangular mount on which an electronic component is to be mounted and a sidewall surrounding the mount. The electronic-component-housing package comprises a lead terminal extending from an inside of a space enclosed by the sidewall to an outside of the space. A tip part of the lead terminal is extending along one side of the mount.

Electronic-component-housing package and electronic device

An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member () is used which comprising at least five layers including first metal layers () having good thermal conductivity and second metal layers () having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (), the first metal layers () and second metal layers () being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer () being thicker than that of the lowermost and uppermost layers. Accordingly, heat generated from the electronic component () can be dissipated well to the outside, and a coefficient of thermal expansion of a mounting portion () can be brought close to that of the electronic component () or the like.

Electronic component storing package and electronic apparatus

A battery case as an electronic component case includes a second conductive plate made of metal, an insulating wall having an upper end surface and a bottom end surface, a first conductive plate made of metal joined to an upper end surface of the insulating wall, and a second conductive plate attached to the bottom end surface of the insulating wall. The insulating wall has a first conductor layer formed on an entire perimeter of the upper end surface thereof and a second conductor layer formed on an entire perimeter of a lower surface thereof, an electrode formed at a peripheral portion of the lower surface of the insulating wall so as to be electrically independent from the second conductor layer, an external connection terminal brazed to the electrode, and a connection conductor formed from the first conductor layer to the electrode. The first conductive plate is attached to the insulating wall via the first conductor layer. The second conductive plate is attached to the insulating wall via the second conductor layer.

Growing community of inventors

Higashiomi, Japan

Yoshiaki Ueda