Hitachi Metals, Ltd.

Yoshiaki Takada

Shinji Furuichi

Hirohide Yamada

Masahiro Ao

Shigetoshi Morita

Akira Taguchi

Shunichi Taka

Atsushi Kazama

Takanori Aono

Ryoji Okada

Masakatsu Saitoh

Hiroyuki Hatano

Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.

Semiconductor sensor device and method for manufacturing same

An acceleration sensor, which has realized such a high impact-resistance that a weight bottom surface of an acceleration sensor element does not directly collide with an inner bottom plate of a protection case made of ceramic, glass or silicon to avoid edges and corners of the weight bottom surface of the acceleration sensor element chipping, even when an excessive acceleration or impact is applied to the acceleration sensor. The acceleration sensor comprises the acceleration sensor element having in a center a weight that works as a pendulum when acceleration is applied, and the protection case housing the acceleration sensor element. The inner bottom plate of the protection case works as a regulation plate to prevent the weight from excessively swing downwards. An impact buffer material of a metal layer or a resin layer is provided on the weight bottom surface or the inner bottom plate of the protection case.

Impact-resistant acceleration sensor

A floating type magnetic head is made of a polycrystalline material. A surface to be opposed to a magnetic recording medium is undulated with lands and grooves having a height difference of 50 to 200 .ANG. on an average and a repetition pitch of 5 to 20 microns on an average. The portions, in which the heights of the lands and the grooves abruptly change, extend along the boundaries of the polycrystals. The head surface opposed to the magnetic recording medium is sputter-etched to have the predetermined surface roughness.

Method of fabricating a magnetic head by sputter etching

A floating type magnetic head is made of a polycrystalline material. A surface to be opposed to a magnetic recording medium is undulated with lands and grooves having a height different of 50 to 200 .ANG. on an average and a repetition pitch of 5 to 20 microns on an average. The portions, in which the heights of the lands and the grooves abruptly change, extend along the boundaries of the polycrystals. The head surface opposed to the magnetic recording medium is sputter-etched to have the predetermined surface roughness.

Floating magnetic head having improved static friction coefficient

Growing community of inventors

Mohka, Japan

Yoshiaki Takada