Panasonic Corporation

Yoshiaki Shimizu

Toshiyuki Fukuda

Yuichiro Yamada

A semiconductor device capable of realizing highly reliable three-dimensional mounting, and a method of manufacturing the same, are provided. A projected electrodeis formed in a region outside of an element mounting region of a substrate. The projected electrodeincludes a protruding portion that protrudes from the front face of a molding resin portion. The distal end of the protruding portion is a flat face. In addition, a portion of the projected electrodewhose cross section is larger than the protruding portion is positioned inside the molding resin portion

Semiconductor device and method of manufacturing the same

According to the present invention, on a double-sided substrate, a plurality of through-holesconnected to one wirefor plating as well as wiring are collectively arranged within a narrow range close to the connection portion. After a plating process, a penetrating holeis formed and the connection potion is cut off. Thus, the wirefor plating and the collectively arranged through-holesare made independent of one another so that no electric conduction occurs among the wirefor plating and the through-holes

Substrate and manufacturing method of the same

A wiring board for manufacturing a resin-molding type semiconductor device includes a plurality of element regions each having a mount region on which a semiconductor element is mounted and an electrode wire, and a peripheral region surrounding the plurality of element regions and having resin-gripping means such as through holes engaged with a resin with which the plurality of element regions and the peripheral region are sealed.

Growing community of inventors

Kadoma, Japan

Yoshiaki Shimizu