Hitachi, Ltd.

Renesas Electronics Corporation

Asahi Kogaku Kogyo Kabushiki Kaisha

Fujirebio Kabushiki Kaisha

Nec Corporation

Nippon Chemiphar Co., Ltd.

Eisai R&d Management Co., Ltd.

Fujifilm Corporation

Mitsumi Electric Company Ltd.

Sony Corporation

Tdk Corporation

Mitsubishi Chemical Corporation

Nec Solution Innovators, Ltd.

Koha Co., Ltd.

Nagoya University

Yoshiaki Sato

Hironobu Kawahara

Ryooji Fukuyama

Yoshimi Torii

Yoshinao Kawasaki

Kazuo Nojiri

Masayuki Kojima

Takashi Yamada

Kazuyuki Suko

Keizo Kuroiwa

Michimasa Hunabashi

Mitsuo Masaki

Kazuyuki Nakagawa

Makoto Nawata

Nobuya Sakai

Yoshikazu Isowa

Yoshiharu Nakashima

Masaki Uehara

Kenji Hirate

Shuuichi Kariyazaki

Yutaka Kakehi

Keita Tsuchiya

Noriyoshi Hiroi

Akira Kawaraya

Yoshie Sato

Shinji Baba

Kimiaki Ogawa

Yoshio Wakui

Hitoshi Harada

Hiroshi Ishihara

Katsuyoshi Kudo

Hiroyuki Chiba

Norihisa Miyake

Kotaro Fujimoto

Tomoyuki Sasaki

Hiroyuki Uchida

Masahiro Takizawa

Yutaka Uematsu

Hiroyuki Watanabe

Atsushi Okuyama

Tomohiko Osaka

Akira Matsumoto

Norio Chujo

Koichi Arai

Yoshihisa Soutome

Yoshinori Miyaki

Hideta Habara

Nobuaki Takanashi

Hiroyuki Karasawa

Noriyuki Kobayashi

Seiji Kondo

Kazuhiro Tsujita

Mari Dezawa

Gaku Nakano

Kentaro Saito

Hiroshi Ikawa

Minoru Soraoka

Kazuo Hongo

Hideki Kihara

Takeshi Yatsuo

Masayoshi Yagyu

Yoshinori Deguchi

Junichi Arita

Tadamitsu Kanekiyo

Katsuya Watanabe

Yoshihisa Yamazaki

Toshihiko Honma

Yuki Komatsu

Toshiaki Nakajima

Yuji Kayashima

Takafumi Kurokawa

Tomoo Sato

Katsushi Terajima

Naoki Ozeki

Susumu Inoue

Kenji Akiyoshi

Ryohtaroh Tanimura

Yoshie Tanaka

Teruo Kutsuma

Hiroyuki Okuda

Shinobu Shimizu

Teiji Takigawa

Mitsunobu Wansawa

Ken Aoshima

Francois Bernier

Eiichi Nakajima

Takeshi Tsubaki

Hidenori Takesue

Mitsuru Katamoto

Tsuyoshi Umemoto

Tooru Yukimasa

Hirofumi Kakutani

Mizuki Anabuki

Toshihiko Suzuki

Masahiro Hayakawa

Masaaki Mizuno

An irreversible circuit element includes: a housing; a plurality of irreversible circuit plates accommodated in the housing; and a plurality of terminals connected to an outer surface of the housing, the plurality of irreversible circuit plates are arranged such that the adjacent irreversible circuit plates face each other, each of the plurality of irreversible circuit plates includes a metal layer, a first insulating layer, a loss layer, and a first magnetic field applying layer laminated in sequence in a thickness direction, each of the plurality of irreversible circuit plates transmits a signal irreversibly between a first end and a second end, and the first end and the second end of each of the plurality of irreversible circuit plates are connected to different terminals of the plurality of terminals.

Irreversible circuit element and method of manufacturing irreversible circuit element

Execution restrictions on tasks based on a state of a multifunction robot or the like are satisfied, and furthermore, the execution efficiency of the entirety of an operation is also enhanced. An information processing device includes a determination unit that determines an execution order of a plurality of tasks including an operation for a target object, based on a transition of a state of an operation tool used in each of the tasks.

Information processing device and scheduling method

In order to provide a technique for improving precision of location estimation using a video, a location estimation device includes: a video processing unit that executes video processing including location estimation of an imaging unit, based on a plurality of feature points extracted from a video captured by the imaging unit and composed of a plurality of frames; and an imaging control unit that determines, on the basis of video-related information acquired in the video processing on a first frame belonging to a first group out of the plurality of frames, an exposure condition of the imaging unit in a second frame belonging to a second group different from the first group out of the plurality of frames.

Location estimation device, location estimation method, and program recording medium

In a method of manufacturing a semiconductor device according to one embodiment, after a semiconductor wafer including a non-volatile memory, a bonding pad and an insulating film comprised of an organic material is provided, a probe needle is contacted to a surface of the bonding pad located in a second region, and a data is written to the non-volatile memory. Here, the insulating film is formed by performing a first heat treatment to the organic material. Also, after a second heat treatment is performed to the semiconductor wafer, and the non-volatile memory to which the data is written is checked, a barrier layer and a first solder material are formed on the surface of the bonding pad located in a first region by using an electroplating method. Further, a bump electrode is formed in the first region by performing a third heat treatment to the first solder material.

Method of manufacturing semiconductor device

The present invention is to provide an acrylic matte resin film with good matte appearance, high thermal stability during molding, stable production, in addition, excellent appearance design, high mechanical strength, easy handling, and applicability for various applications. Provided is an acrylic matte resin film which has a surface having a 60&#xb0; surface glossiness (Gs60&#xb0;) of less than 100% on at least one of the films, wherein an arithmetic mean roughness (Ra) of the surface having the surface glossiness satisfies the following formula (1) and wherein the surface satisfying the following formula (1), comprises an acrylic resin composition (a) has a gel content of 40% by mass or more:2.2&#xd7;60&#xb0;&#x2264;4.4&#xd7;60&#xb0;. . .&#x2003;&#x2003;(1)wherein NGs indicates a value obtained by excluding % from Gs60&#xb0;, which is less than 100%.

Acrylic matte resin film

An object of the present invention is to improve manufacturing efficiency of a semiconductor device. The method of manufacturing a semiconductor device includes a sealing step of sealing a semiconductor chip mounted on the wiring substrate. The sealing step includes a step of arranging the wiring substrate between an upper mold and a lower mold, suctioning a lower surface of the wiring substrate with the plurality of suction holes, thereby holding the wiring substrate the upper mold, and a step of sealing the semiconductor chip, an upper surface of the wiring substrate, and the plurality of side surfaces of the wiring substrate such that each of the semiconductor chip, the upper surface of the wiring substrate, and the plurality of side surfaces of the wiring substrate is covered with the resin in the lower mold.

A muscle training method includes the following steps that are repeated alternately to perform training of a muscle of a user: a pressuring and exercise step (S, S, S, S) of winding a belt around at least one of four limbs of the user and applying specific pressure thereto so as to restrict blood circulation of the muscle of the user without stopping the blood circulation, and asking the user to perform load-applied exercise to apply load of specific weight to the muscle of the user; and an exercise stopping step (S, S, S, S) of asking the user to stop the load-applied exercise while continuously applying the specific pressure to the user. The specific weight is set at a value smaller than maximum weight necessary for the user to exert maximum muscle force.

Muscle training method and muscle training system

An acquisition unit acquires a photographed image data which is photographed by a user at a first position in a space. The photographed image includes at least any of the multiple markers. An identification unit identifies the first position, on which user have photographed an image, based on the markers included in the photographed image. An informing unit identifies second position relative to the first position identified by the identification unit, and informs the user of the second position relative to the first position.

Information processing device, information processing system, position reporting method, and program recording medium

A semiconductor device includes a semiconductor chip mounted over a wiring substrate. A signal wiring for input for transmitting input signals to the semiconductor chip and a signal wiring for output for transmitting output signals from the semiconductor chip are placed in different wiring layers in the wiring substrate and overlap with each other. In the direction of thickness of the wiring substrate, each of the signal wirings is sandwiched between conductor planes supplied with reference potential. In the front surface of the semiconductor chip, a signal electrode for input and a signal electrode for output are disposed in different rows. In cases where the signal wiring for output is located in a layer higher than the signal wiring for input in the wiring substrate, the signal electrode for output is placed in a row closer to the outer edge of the front surface than the signal electrode for input.

Semiconductor device

A Q value of the RF irradiation coil is easily obtained in a state in which an object is disposed in an MRI apparatus, and an SAR is predicted with high accuracy. For this, an irradiation coilirradiates an objectwith a high frequency magnetic field pulse in a state in which the objectis disposed in an imaging space, and a transmitted voltage and a reflected voltage of the irradiation coilare detected. A Q value of the irradiation coil in a state of the objectbeing disposed is obtained on the basis of the transmitted voltage and the reflected voltage. A specific absorption rate (SAR) in a case of executing an imaging pulse sequence on the object is predicted by using the Q value.

Magnetic resonance imaging apparatus and SAR prediction method

A semiconductor device which provides improved reliability. The semiconductor device includes: a wiring substrate having a first surface and a second surface opposite to the first surface; a chip condenser built in the wiring substrate, having a first electrode and a second electrode; a first terminal and a second terminal disposed on the first surface; and a third terminal disposed on the second surface. The semiconductor device further includes: a first conduction path for coupling the first terminal and the third terminal; a second conduction path for coupling the first terminal and the first electrode; a third conduction path for coupling the third terminal and the first electrode; and a fourth conduction path for coupling the second terminal and the first electrode.

Provided is a lens drive device that, using drive force from a voice coil motor, automatically carries out focusing by moving an autofocus movable unit with respect to an autofocus fixed unit in the direction of an optical axis. The lens drive unit is provided with a position detection unit that is disposed with an intervening space on the image formation side of the autofocus movable unit in the direction of the optical axis and that is for emitting light toward the autofocus movable unit, receiving reflected light that has been reflected by the autofocus movable unit, and detecting the position of the autofocus movable unit in the direction of the optical axis on the basis of the received light intensity. Part of the member displaced along with the autofocus movable unit functions as a reflective plate for reflecting light emitted from the position detection unit.

Lens drive device, camera module, and camera-mounting device

An identification unit obtains a plurality of photographic images including two or more markers. The makers are placed on a different object, respectively. The identification unit identifies, from the plurality of photographic images thus obtained, three-dimensional positions of the two or more markers. A generating unit transforms coordinate system of the plurality of photographic images into a common coordinate system. Relative positions of the two or more markers based on a specific location are indicated in the common coordinate system. The generating unit generates map data which associates the positions of the two or more markers.

Map generating device, map generating method, and program recording medium

A semiconductor device includes a wiring substrate including a first surface and a second surface opposite to the first surface, a semiconductor chip including a plurality of chip electrodes and mounted over the wiring substrate, a first capacitor arranged at a position overlapping with the semiconductor chip in plan view and incorporated in the wiring substrate, and a second capacitor arranged between the first capacitor and a peripheral portion of the wiring substrate in plan view. Also, the second capacitor is inserted in series connection into a signal transmission path through which an electric signal is input to or output from the semiconductor chip.

According to an embodiment of the present invention, there is provided a semiconductor device having a first semiconductor component and a second semiconductor component which are mounted on a wiring substrate. The first semiconductor component has a first terminal for transmitting a first signal between the first semiconductor component and the outside and a second terminal for transmitting a second signal between the first semiconductor component and the second semiconductor component. In addition, the second semiconductor component has a third terminal for transmitting the second signal between the second semiconductor component and the first semiconductor component. Further, the first signal is transmitted at a higher frequency than the second signal. Furthermore, the second terminal of the first semiconductor component and the third terminal of the second semiconductor component are electrically connected to each other via the first wiring member. In addition, the first terminal of the first semiconductor component is electrically connected to the wiring substrate via a first bump electrode without the first wiring member interposed therebetween.

Growing community of inventors

Tokyo, Japan

Yoshiaki Sato