Mitsubishi Materials Corporation

Yoshiaki Sakaniwa

Toyo Ohashi

There is provided an insulating resin circuit substrate including an insulating resin layer and a circuit layer consisting of a plurality of metal pieces disposed to be spaced apart in a circuit pattern shape on one surface of the insulating resin layer, in which in a case where a surface of the insulating resin layer in a gap between the metal pieces is analyzed by SEM-EDX, the area rate of a metal element constituting the metal pieces is less than 2.5%.

Insulating resin circuit substrate

An insulated circuit substrate manufacturing method of the present invention includes a metal piece disposing step of disposing the metal piece in a circuit pattern shape on a resin material serving as the insulating resin layer and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction. In the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization.

Insulated circuit substrate manufacturing method

Provided is an insulating circuit board including: an insulating resin layer; and a circuit layer made of metal pieces, each of which is in a circuit pattern and provided on one surface of the insulating resin layer, wherein thickness of each of the metal pieces constituting the circuit layer is 0.5 mm or more, the insulating resin layer is made of a thermosetting resin, and a void ratio in regions between the metal pieces is 0.8% or less.

Insulating circuit board

A heat sink integrated insulating circuit substrate includes: a heat sink including a top plate part and a cooling fin; an insulating resin layer formed on the top plate part of the heat sink; and a circuit layer made of metal pieces arranged on a surface of the insulating resin layer opposite to the heat sink, wherein, when a maximum length of the top plate part is defined as L, an amount of warpage of the top plate part is defined as Z, and deformation of protruding toward a bonding surface side of the top plate part of the heat sink is defined as a positive amount of warpage, and a curvature of the heat sink is defined as C=|(8×Z)/L|, a ratio P/Cbetween a maximum curvature C(I/m) of the heat sink during heating from 25° C. to 300° C. and peel strength P (N/cm) of the insulating resin layer satisfies P/C>60.

Heat sink integrated insulating circuit board

An insulating circuit substrate includes an insulating layer; and a circuit layer formed on one surface of the insulating layer, in which the insulating layer has a core layer formed of an epoxy resin containing an inorganic filler, and a skin layer formed on the circuit layer side of the core layer and formed of a polyimide resin containing an inorganic filler, an amount of the inorganic filler in the epoxy resin forming the core layer is in a range of 80 vol % or more and 95 vol % or less, and an amount of the inorganic filler in the polyimide resin forming the skin layer is in a range of 10 vol % or more and 30 vol % or less.

Growing community of inventors

Saitama, Japan

Yoshiaki Sakaniwa