Hitachi, Ltd.

Hitachi Vlsi Engineering Corp.

Hitachi Microcomputer Engineering, Ltd.

Vlsi Engineering Corporation

Yoshiaki Ouchi

Yutaka Kobayashi

Kazumasa Yanagisawa

Goro Kitsukawa

Hitoshi Miwa

Atsushi Nozoe

Masayuki Nakamura

Tetsurou Matsumoto

Shoji Wada

Tetsu Udagawa

Yoshitaka Kinoshita

Kyoko Ishii

Tatsuyuki Ohta

Kazuo Mihashi

Hiromi Tsukada

Kazuyuki Miyazawa

Masamichi Ishihara

Tetsuro Matsumoto

A Bi.CMOS semiconductor memory device is provided which includes an arrangement to simultaneously select a plurality of memory cells, followed by using a 3 bit Z addressing arrangement to determine a read or write operation for the simultaneously selected memory cells. To speed up the word line selection, a static selection type operation is used with the word line selecting voltage being greater than signal amplitude of the data lines during the write operation. Also, to speed up the read operation, separate common I/O lines are provided for the read and write operations. Read signals are transmitted as current signals, and then converted to voltage signals for improving reading speed. Also, improved arrangements are provided for resistance structure, logic circuitry, input circuitry, fuse cutting circuitry, drive circuitry, power circuitry, electrostatic protection circuitry, layout structure and testing methods for the semiconductor device.

Dynamic Random Access Type Semiconductor Device

Testing method for a semiconductor memory device

A Bi.CMOS semiconductor memory device is provided which includes an arrangement to simultaneously select a plurality of memory cells, followed by using a 3 bit Z addressing arrangement to determine a read or write operation for the simultaneously selected memory cells. To speed up the word line selection, a static selection type operation is used with the word line selecting voltage being greater than signal amplitude of the data lines during the write operation. Also, to speed up the read operation, separate common I/O lines are provided for the read and write operations. Read signals are transmitted as curent signals, and then converted to voltage signals for improving reading speed. Also, improved arrangements are provided for resistance structure, logic circuitry, input circuitry, fuse cutting circuitry, drive circuitry, power circuitry, electrostatic protection circuitry, layout structure and testing methods for the semiconductor device.

Bi-CMOS semiconductor memory device, including improved layout structure

An address multiplex type system for a dynamic RAM includes a memory cell array having a plurality of memory cells which are simultaneously selected by signals output from an address decoder, a decoder, and a shift register. The dynamic RAM further includes a selecting circuit which receives a plurality of address signals applied externally through one of a plurality of pins of a package in a time-sharing manner and makes it possible to write or read data into or from one memory cell of the plurality of memory cells selected. The dynamic RAM can read out or write in serially data of a plurality of memory cells selected from the memory cell array when a shift register operates. The dynamic RAM can also read or write data serially into or from a plurality of memory cells selected from the memory cell array simply by connecting the pin to a predetermined potential. When the data is written or read serially, the pin arrangement of the package of a 256K bit dynamic RAM can be substantially the same as that of the package of a 64K bit dynamic RAM. Hence, compatibility can be established between the 256K bit dynamic RAM and a 64K bit dynamic RAM.

Semiconductor memory device

Growing community of inventors

Fussa, Japan

Yoshiaki Ouchi