Toshiba Memory Corporation

Kioxia Corporation

Toshiba Memory Cororation

Yoshiaki Osada

Kosuke Hatsuda

Yorinobu Fujino

Katsuhiko Hoya

Jieyun Zhou

According to one embodiment, a memory device includes first and second wiring lines, memory cells between first and second wiring lines, first and second common wiring lines, a first selecting circuit between one ends of the first wiring lines and the first common wiring line, and a second selecting circuit between the other ends of the first wiring lines and the first common wiring line. A path between the first wiring line and the first common wiring line through the first selecting circuit and a path between the first wiring line and the first common wiring line through the second selecting circuit are defined as first and second paths, one of the first and second paths is set to an electrically conductive state.

Memory device

According to one embodiment, a magnetic storage device includes a magnetoresistive element having a first end and a second end. A first switch is between the first end and a first wiring. A second switch is between the second end and a second wiring. A third switch is between the first end and a third wiring. A fourth switch is between the second end and a fourth wiring. A driver is connected to the first wiring and the second wiring and is configured to supply, to the first wiring, a current at a magnitude set based on a voltage at the first end and a voltage at the second end.

Magnetic storage device

According to one embodiment, a memory device includes: a first and a second interconnects; a memory cell including a variable resistive element, the memory cell between the first and second interconnects; and a write circuit including a current source circuit and a voltage source circuit, the write circuit writing data to the memory cell by using a write pulse. The write circuit supplies the write pulse to the memory cell by using the current source circuit in a first period from a first time of a start of supply of the write pulse to a second time, and supplies the write pulse to the memory cell by using the voltage source circuit in a second period from a third time to a fourth time of an end of the supply of the write pulse.

According to one embodiment, a semiconductor storage device includes: a first conductor coupled to a first end of a first cell; a second conductor which couples between a second end of the first cell and a first end of a second cell; a third conductor coupled to a second end of the second cell; a first current source being capable of coupling to the first cell via the first conductor; a second current source being capable of coupling to the second cell via the third conductor; a first sense amplifier configured to read data from the first cell based on a current flowing from the first current source to the first cell; and a second sense amplifier configured to read data from the second cell based on a current flowing from the second cell to the second current source.

Semiconductor storage device

According to one embodiment, a memory device includes a preamplifier configured to execute a first read in which a first current relating to a memory cell is passed through a first path and a second current relating to the first current is passed through a second path, to generate a first voltage, to write first data to the memory cell; and to execute a second read in which a third current relating to the memory cell with the first data written thereto is passed through the first path and a fourth current relating to the third current is passed through the second path, to generate a second voltage; and a sense amplifier configured to determine data stored in the memory cell during execution of the first read based on the first voltage and the second voltage.

According to one embodiment, a memory device includes a memory cell; a first circuit that performs a first read on the memory cell, writes first data in the memory cell on which the first read has been performed, performs a second read on the memory cell in which the first data has been written, determines data from a result of the first read based on a result of the second read, and writes back the determined data into the memory cell; and an error correcting circuit that performs error correction on the determined data.

According to one embodiment, a semiconductor storage device includes a memory cell, a bit line connected to the memory cell, and a sense circuit connected to the bit line, wherein the sense circuit includes a first transistor with a first end connected to the bit line, a second transistor with a first end connected to a second end of the first transistor, a third transistor with a first end connected to the bit line, a fourth transistor with a first end connected to a second end of the third transistor, and an amplifier connected to a second end of the second transistor and to a second end of the fourth transistor.

According to one embodiment, a memory device includes a memory cell; and a first circuit configured to perform first read for the memory cell and generate a first voltage, write first data to the memory cell that has undergone the first read, perform second read for the memory cell to which the first data written and generate a second voltage, generate a first current based on the first voltage, generate a second current based on the second voltage, and add a third current to one of the first current and the second current, thereby determining data stored in the memory cell at the time of the first read.

According to one embodiment, a memory system includes: a first memory cell area where a first memory cell is provided; a second memory cell area where a second memory cell is provided; an ECC circuit which corrects an error of data stored by the first memory cell; and a control circuit which replaces the first memory cell with the second memory cell if the number of times an error is successfully corrected in the first memory cell reaches a first value.

Growing community of inventors

Kawasaki Kanagawa, Japan

Yoshiaki Osada