Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Kanto Chemical Co., Inc.

Yoshiaki Okabe

Takao Miwa

Masahiro Yoshida

Akio Mukoh

Kenji Suzuki

Hisao Yokokura

Teruo Kitamura

Mikio Sato

Shintaroo Hattori

Tsunenori Fujii

Kaoru Koto

Hisashi Okawa

Akio Takahashi

Shuji Eguchi

Takumi Ueno

Seikichi Tanno

Shunichi Numata

Hiroyuki Kagawa

Yasunari Maekawa

Hideki Asano

Noriaki Taketani

Mina Ishida

Yoichi Hirai

Yuichi Satsu

Tomiya Abe

Motoyo Wajima

Shin Nishimura

Koji Fujisaki

Masahiro Suzuki

Hiromu Terao

Masanori Nemoto

Takayoshi Ikeda

Hisae Shimanoki

Tuneo Narusawa

Yoshimitsu Mihara

Yukihiko Takada

Rie Tawata

Geraldine Rames-Langlade

Hideki Ohmori

A recyclable epoxy resin composition using a plant biomass in a resin skeleton and a cured material of the epoxy resin composition, and various types of products using them are provided. The epoxy resin composition comprises an epoxy resin; and a curing agent, wherein the curing agent is a biomass-derived acid anhydride having an acid anhydride bonded via an ester linkage to a biomass with a weight-average molecular weight of 300 to 5000.

Biomass-derived epoxy resin composition

There is disclosed a biomass-derived epoxy compound as an epoxidized product of a raw-material biomass-derived compound having a weight-average molecular weight of 300 to 10000. The biomass-derived epoxy compound has a weight-average molecular weight of 600 to 20000 and is soluble in an organic solvent for the preparation of a varnish. The epoxy compound is prepared by dissolving the raw-material biomass-derived compound in an aqueous alkali solution; adding epichlorohydrin to the solution and heating the mixture; and evaporating epichlorohydrin from the heated mixture and precipitating a biomass-derived epoxy compound, in which the aqueous alkali solution has a pH of 13.5 to 11.0. The biomass-derived epoxy compound has both high solubility in organic solvents and satisfactory heat resistance and can be manufactured in a high yield on the basis of the raw material through a less number of processes.

Biomass-derived epoxy compound and manufacturing method thereof

A photosensitive composition comprising a polyimide precursor, a photosensitive material having a structure represented by the following formula

Photosensitive resin composition, method for forming pattern therefrom, electronic devices produced by using the same, and method for production thereof

A highly reliable positive type photosensitive resin composition composed of diamine having a carboxyl group as a structural unit, which can be developed with an alkaline aqueous solution, comprising polyamic acid ester having hydrophobic group, o-quinonediazidesulfonyl amide compound, and/or o-quinonediazidesulfonyl amide sulfonic ester compound, and electronic devices using the same. A polyamide film having preferable positive type relief patterns, of which the unexposed portion is not corroded, can be obtained.

Positive photosensitive resin composition and electronic apparatus using

A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.

Thin film wiring board

A photosensitive resin composition comprising (a) a polymer having carboxyl groups (b) a photoacid generator which generates an acid when irradiated with light, and (c) an aliphatic amine is capable of development with ease by use of a wide variety of aqueous solvents.

Photosensitive resin composition containing a carboxylic acid polymer,

Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film is formed as a highly adhesive film on a low-thermal-expansivity polyimide film in a half-cured state, then metallic wiring is applied thereon, followed by formation of another highly adhesive thin film in a half-cured state, and then a low-thermal-expansivity polyimide film is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film and the wiring pattern layer or the substrate.

Method for forming multilayer wiring construction

A plastic optical fiber comprising a core and a clad, said core being formed by an amorphous and optically transparent polymer and said clad being formed by a polymer having a refractive index lower than that of the core by at least 0.3%, at least one of the core and the clad being formed by an amorphous and optically transparent polymer containing metal elements and halogen atoms, is low in light loss and excellent in heat resistance.

Plastic optical fibers from polymers derived from metallic salts of

This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread out on the substrate surface.

Mechanical part mounting chassis with integrated circuit

A colorless liquid crystalline compound having at least one 6-membered ring and non-cyclic end groups in the molecular skeleton, said 6-membered ring containing two or more carbon atoms, at least one of which is directly bonded to a methylene group of a non-cyclic group having an alkoxy group at another end has a wide mesomorphic range. When said colorless liquid crystalline compound is mixed with a liquid crystal composition, the resulting mixture also has an enlarged mesomorphic range and in almost all cases has a reduced viscosity.

Colorless liquid crystalline compounds

The liquid crystal compound of this invention is characterized by having the general formula.

Liquid crystal compound and liquid crystal composition

A colorless liquid crystalline compound having at least one 6-membered ring and non-cyclic end groups in the molecular skelton, said 6-membered containing two or more carbon atoms, at least one of which is directly bonded to a methylene group of a non-cyclic group having an alkoxy group at another end has a wide mesomorphic range. When said colorless liquid crystalline compound is mixed with a liquid crystal composition, the resulting mixture also has an enlarge mesomorphic range and in almost all cases has a reduced viscosity.

Growing community of inventors

Hitachi, Japan

Yoshiaki Okabe