Opnext Japan, Inc.

Yoshiaki Niwa

Naoki Matsushima

Hideyuki Kuwano

Kazumi Kawamoto

Kazuyuki Fukuda

Keiichi Yamada

Shohei Hata

Hiroshi Moriya

Kisho Ashida

Hideo Sotokawa

Toshiaki Takai

Masahiro Hirai

Tetsuya Kato

Tetsuya Katou

A transmission line with a bending portion is provided, which line comprises any one of a coplanar line, another coplanar waveguide line formed on the dielectric substrate under which a ground layer is provided and a coplanar strip line. A chamfered portion is provided on the outer angular portion of the bending portion of the signal wiring conductor and a triangular conductor is disposed to an inner angular portion thereof. Given that length of the chamfered portion is defined as a, and length of the wiring edge side of the triangular conductor is defined as b and width of the signal wiring conductor is defined as c, it is arranged such that a is greater than b+c&#xd7;square root of 2. Thereby, a transmission line or an optical module of smaller reflection loss at the bending portion thereof and of improved high-frequency characteristics is provided.

High-frequency transmission line and an optical module incorporating the same line

The present invention provides an optical module, and an optical transmission line comprising the optical module. The optical module has a structure in which an optical-modulator-mounted carrier is formed of a semiconductor substrate; a transmission line on the carrier is formed of a coplanar waveguide; a transmission line for inputting a signal into the transmission line is formed on a dielectric substrate; the transmission line on the input side which is a grounded coplanar waveguide is coupled by a conversion line to the transmission line on the output side which is a coplanar waveguide; and an electrical connection between the transmission lines is made by use of a conductor wire.

Optical module and optical transmission apparatus

An optical coupling apparatus having a temperature control element on which a semiconductor light emitting element, a substrate and a lens are mounted, the semiconductor light emitting element being mounted on the substrate, and rays of light from the semiconductor light emitting element being introduced into the lens. A base on which the temperature control element is disposed, a through-hole portion formed in a housing wall portion installed on the base, penetrating through the housing wall portion and having a wall surface portion longer than a thickness of the housing wall portion and an optical fiber communicated with the through-hole portion and receiving converted light from the lens introduced thereto. A length of the substrate in a direction connecting the light emitting element to the optical fiber is within a range from 0.1 to 0.25 with respect to a length of the base sandwiched by the housing walls of the substrate.

Optical coupling apparatus

In a semiconductor laser module, in order to sufficiently reduce the thermal stress arising in a due to the bonding of elements when they are packaged and to improve the yield of production, the semiconductor laser module is provided with a semiconductor laser element, a submount bonded to the semiconductor laser element with a solder layer in-between and thereby mounted with it, and a base mounted with this submount with another solder layer in-between. Herein, T/W&#x2267;0.15 holds, where W is the width of the submount in the direction orthogonal to the optical axis of the semiconductor laser element and T is the thickness of the submount.

Semiconductor laser module

The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.

Optical module and method for manufacturing optical module

According to the present invention there are provided a transmission line and an optical module having the transmission line, the transmission line having on a dielectric substrate a first signal wiring conductor, a second signal wiring conductor insulated from the first signal wiring conductor, a first electrode disposed near the first and second signal wiring conductors, a second electrode disposed near the second signal wiring conductor, and a ground wiring conductor disposed in adjacency to the second electrode, wherein a passing frequency band can be changed by changing the connection of conductor wires.

Transmission line, optical module using the same and manufacturing method of optical module

In an optical coupling apparatus, an optical isolator and an optical fiber are arranged inside a pipe of a side surface of a package. A distal end of the optical fiber is arranged within a range of 3.0 mm from an inner/outer surface of the side surface of the package and a distance from a laser diode to the distal end is within a range from 3.5 to 7.5 mm. Distance from the inner side surface of the package to a Peltier device is within a range of 6.0 mm. A metallize pattern film applied to a terminal substrate of the package and the Peltier device are connected through wiring bonding and a connection position is closer to the optical fiber than a lead terminal provided to the terminal substrate of the package that corresponds to the Peltier device.

Growing community of inventors

Yokohama, Japan

Yoshiaki Niwa