Fujitsu Semiconductor Limited

Yoshiaki Narisawa

Takao Nishimura

Yoshikazu Kumagaya

In a semiconductor chip, a first semiconductor chipis provided on a chip-mounting component, and bonding wiresconnected to electrode padsE of the first semiconductor chipare fixed by being covered with a first insulating adhesive. A second semiconductor chipis mounted by being stacked on the first semiconductor chip, with the first insulating adhesivetherebetween. This structure can prevent problems such as breaking and short-circuits of bonding wires of the chip disposed directly on a substrate when another chip is mounted by being stacked.

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.

Method for mounting electronic components

To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substratehaving an electrodeA arranged on its surface; and a first semiconductor elementA which includes an electrodearranged on its surface and which is supported by the substrate, wherein a first wireis connected through a first bumpto at least one of the electrodes over the substrateand semiconductor elementA (i.e., at least one of the electrodesand), and a second wireis connected through a second bumpto a bonding portion of the wire

Semiconductor device and manufacturing method for the same

A relay board provided in a semiconductor device, including an entire main surface that is made of a conductive material. The relay board may further include a substrate made of the same material as at least one semiconductor element provided in the semiconductor device. The main surface of the relay board may be formed at an upper part of the substrate.

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

A semiconductor device, includes a wiring board; a first semiconductor element mounted on the wiring board; a second semiconductor element mounted on the first semiconductor element so that a position of the second semiconductor element is shifted relative to a position of the first semiconductor element; wherein a part of a main surface of the second semiconductor element faces the first semiconductor element; and an electrode pad provided on the main surface of the second semiconductor element is connected to a second semiconductor element connection pad of the wiring board by a connection part.

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Kawasaki, Japan

Yoshiaki Narisawa