Nitto-denko Corporation

Nitto Europe N.v.

Yoshiaki Mitsuoka

Miho Yamaguchi

Mitsuyoshi Shirai

Yoshitada Morikawa

Michio Komoto

Takahiro Fujii

Hiroki Fujii

Takehiro Ui

Mitsuo Matsumoto

Yuuzou Akada

Youhei Hayashi

Tetsuro Taga

Shinichiro Kose

Akihiro Kiriyama

Walter Eevers

Ann Issaris

Edwin Thys

A double-sided adhesive tape includes a substrate, and a thermosetting resin layer laminated on both sides of the substrate. The thermosetting resin layer contains a rubber-modified epoxy resin and a latent curing agent. The thermosetting resin layer has a flowtester viscosity at 40&#xb0; C. and under a load of 20 Kg of 1000 Pa&#xb7;s or more and 7000 Pa&#xb7;s or less.

Double-sided adhesive tape

A pressure-sensitive adhesive composition includes 100 parts by mass of a rubber component containing 40 to 93 mass % of a butyl rubber and 7 to 60 mass % of a polyisobutylene and 82 to 128 parts by mass of a softener having a kinetic viscosity at 40&#xb0; C. of 100 to 9,000 mm/s.

Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and moisture-permeable waterproof pressure-sensitive adhesive sheet

There are provided a foaming filler member which allows, even when the inner space of a hollow member has a protruding space, easy filling of the protruding space without using an extra member, a heat-foamable sheet used for the foaming filler member, a method for manufacturing the heat-foamable sheet, and a method for filling the inner space of the hollow member. A heat-foamable sheet which extends in one direction when heated at 100 to 130&#xb0; C. for 20 minutes and has an extension ratio of 5 to 50% in the extension direction is manufactured by stretch-forming a heat-foamable material. Even when the inner space has the protruding space, the protruding space can be easily filled at low cost without using an extra member by using the heat-foamable sheet as the foaming filler member, disposing the foaming filler member in the main space of the inner space, and foaming it such that the extending direction of the heat-foamable sheet is oriented toward the protruding space.

Heat-foamable sheet, method for manufacturing the same, foaming filler member, and method for filling inner space of hollow member

The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.

Water-permeable adhesive tape

A semiconductor device obtained by encapsulating a semiconductor element with a thermosetting resin composition comprising a thermosetting resin (Component I) and a hardener (Component II) having the following components III and IV incorporated therein. The semiconductor device is thus provided with a high heat resistance at infrared reflow step and a high flame retardance, showing a drastically enhanced reliability. (III) A metal hydroxide represented by the following general formula (1):

Thermosetting resin composition for semiconductor devices

Semiconductor device

Growing community of inventors

Osaka, Japan

Yoshiaki Mitsuoka