Fujitsu Corporation

Sharp Kabushiki Kaisha Corporation

Fujitsu Display Technologies Corporation

Yoshiaki Maruyama

Yoshinori Tanaka

Hiroaki Kobayashi

Katsuhiko Kishida

Hirofumi Miyamoto

Toshiaki Sukeda

Hiromichi Watanabe

Takashi Yuda

Kenichi Kuroiwa

Toshio Sakata

Shinichi Kasahara

Eiji Nittoh

Yuji Kamimoto

Before cutting a gang-printed substrate having a multiplicity of liquid crystal display panel regions provided thereon into individual liquid crystal display panels, a voltage is applied to all of the multiplicity of liquid crystal display panel regions to inspect display defects, polymerize a monomer in the liquid crystal component, and control alignment of the liquid crystal, which allows the time required for a voltage applying step to be reduced and allows a reduction in the manufacturing cost. A dispenser injection process is used to allow a liquid crystal to be injected between mother boards that have not been cut into individual display panels, and a voltage is applied after the pair of glass substrates are combined and before they are cut into individual display panels to perform a test on display defects (dynamic operating test), pretilt control, and an aligning process.

Method of manufacturing liquid crystal display panels

The display apparatus has a common substrate and a TFT substrate, and a flexible printed board is attached to the TFT substrate. ICs are arranged in an area of the TFT substrate in a row along an alignment direction, and connection terminals are arranged in that area by the shorter sides of the ICs along the alignment direction of the ICs. The flexible printed board and ICs can be fitted to the TFT substrate, by an anisotropic electro-conductive film, using a thermo-compression bonding head or heads.

Matrix type display apparatus, method of production thereof, and thermo-compression bonding head

A method for establishing electrical connection of a pressure-connector terminal by forming a plurality of divided terminals by providing a plurality of grooves on a connecting surface of a pressure-connector terminal used for TAB connection and COG connection, placing such divided connecting surfaces in contact with a connecting surface of an opposed terminal electrode, imperfectly hardening a bonding material under such condition, deforming a divided terminal by applying pressure and thereafter perfectly hardening the bonding material and a configuration of the pressure-connector terminal are disclosed.

Method of connecting a pressure-connector terminal of a device with a

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Kawasaki, Japan

Yoshiaki Maruyama