Renesas Electronics Corporation

Renesas Technology Corp.

Mitsubishi Pencil Kabushiki Kaisha

Geltec Co., Ltd.

Yoshiaki Makita

Hiroshi Maki

Masayuki Mochizuki

Hideharu Kobashi

Tatsuyuki Okubo

Keisuke Nadamoto

Ryuichi Takano

Haruhiko Fukasawa

Kyo Nakayama

A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

Fabrication method of semiconductor device

A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.

A grip using a gel substance capable of preserving its own shape is provided in a grip portion of a barrel of a writing implement. An outer coat for covering the grip portion of the barrelis provided. The gel substance is located between the outer coat and the barrel, and comes in direct contact with the barrel. A centering member for positioning the outer coat coaxially with the barrel is provided between the outer coat and the barrel. The centering member is provided with an opening for allowing a space between the outer coat and the barrel to communicate with the outside of the space. The gel substance is formed by injecting a sol substance, which is a raw material, through the opening and by crosslinking the sol substance under a predetermined condition.

Writing implement

Growing community of inventors

Tokyo, Japan

Yoshiaki Makita