Gun Ei Chemical Industry Co., Ltd.

Mitsui Minings & Melting Co., Ltd.

Nippon Kayaku Kabushiki Kaisha

Yoshiaki Kurimoto

Yukio Abe

Akiyuki Kojima

Kaori Hasegawa

Tsuyoshi Fukuda

Satoru Kitano

Katsuhiro Maruyama

Kazuaki Yuba

Masayuki Tsunaga

Satoru Yoshida

Akira Yoshitomo

Ryoichi Hasegawa

Kenichi Kuboki

Yoshio Shimamura

Takao Suzuki

Maraki Hirosawa

Kyoichi Gokan

Masaki Hirosawa

The present invention relates to a novolak type phenol resin, in particular a novolak type phenol resin for resists suitable for forming resist patterns. The novolak type phenol resin of the present invention is obtained by reacting at least a vinylphenol having a vinyl group and a phenolic hydroxyl group, such as parahydroxystyrene, or a polyvinylphenol, which is a polymer of the vinylphenol, a compound (A) such as 4,4&prime;-methylenebis(2-hydroxymethyl-3,6-dimethylphenol) and/or a compound (B) such as 2,6-dihydroxymethyl-4-phenol, in a ratio of 1 to 40 moles of the compound (A) and/or compound (B) to 100 moles of the vinylphenol or 100 moles of structural unit of the vinylphenol contained in the polyvinylphenol in the presence of an acid and having a weight average molecular weight of 2,000 to 20,000. Such a novolak type phenol resin provides good pattern shape, heat resistance, resolution, and sensitivity in resists for lithography.

Novolak type phenol resin

The present invention relates to a phenol resin, in particular a phenol resin for resists suitable for forming resist patterns. The phenol resin of the present invention is obtained by reacting at least two components, i.e., a compound (A) such as 4-hydroxymethyl-2,6-dimethylphenol and a polymerizable phenol compound such as parahydroxystyrene or a polymer (B), which is a polymer of the polymerizable phenol compound, in a ratio of 1 to 50 moles of the compound (A) to 100 moles of the polymerizable phenol compound or 100 moles of structural unit of the polymerizable phenol compound contained in the polymer (B) in the presence of an acid and having a molecular weight of 2,000 to 20,000. Such a phenol resin provides good pattern shape, heat resistance, resolution, and sensitivity in resists for lithography.

Phenol resin

Epoxy resin, epoxy resin composition and hardened product thereof

One of the objects of the present invention is to offer novolak type phenolic resins which use phenols and aldehydes as raw materials and give narrow molecular weight distributions. The novolak type phenolic resins of the present invention are those obtained by condensation reaction of phenols with aldehydes in the presence of an oxycarboxylic acid having carboxyl groups, --COOH, and alcoholic hydroxyl groups, --OH, in one molecule. Thus obtained novolak type phenolic resins show narrow molecular weight distributions, lower viscosity in molten state and, as a consequence, uniformity in curing time.

Novolak type phenolic resins and methods of manufacturing thereof

One of the objects of the present invention is to offer novolak type phenolic resins which use phenols and aldehydes as raw materials and give narrow molecular weight distributions. The novolak type phenolic resins of the present invention are those obtained by condensation reaction of phenols with aldehydes in the presence of an oxycarboxylic acid having carboxyl groups, --COOH, and alcoholic hydroxyl groups, --OH, in one molecule. Thus, obtained novolak type phenolic resins show narrow molecular weight distributions, lower viscosity in molten state and, as a consequence, uniformity in curing time.

The present invention provides a conductive copper composition comprising metal powder, a binder, a dispersant, and a solvent, characterized by containing 100 parts by weight of copper powder in the form of spherical or granule particles coated with silver as the metal powder, 6 to 18 parts by weight of resol resin satisfying the following conditions (a) to (c) as the binder, 0.05 to 1 part by weight of the dispersant, and 2 to 15 parts of the solvent:

Electrically conductive copper composition

A copper conductive composition comprising 100 parts by weight of spherical copper powder coated with silver as metal powder, 6 to 18 parts by weight of resol type phenolic resin containing a dimethylene ether bond in bonded formaldehyde by 5% or more, the molar ratio between the formaldehyde thereof and phenol thereof (formaldehyde/phenol) being 1.0 to 3.0, 0.05 to 1 parts by weight of dispersant, and 2 to 15 parts by weight of solvent. Therefore, an excellent conductivity and solderability of the cured film can be obtained.

Copper conductive composition

Growing community of inventors

Takasaki, Japan

Yoshiaki Kurimoto