Sekisui Chemical Co., Ltd.

Yoshiaki Kodera

Yoshiaki Tanaka

Tatsuo Suzuki

Manabu Matsubara

Kazuo Ukai

Kazuhiko Kanki

Yoshihiro Nakagawa

Hitoshi Hori

Takayuki Kusu

An electrical connection is formed by using a double laminated conductive fine particle provided with a conductive metal layer on the surface of a spherical elastic base particle by electroless plating and electroplating and a layer of a low-melting-point metal on the surface of the conductive metal layer and wherein the conductive metal layer comprises a plurality of metal layers.

CONDUCTIVE PARTICLES AND METHOD AND DEVICE FOR MANUFACTURING THE SAME, ANISOTROPIC CONDUCTIVE ADHESIVE AND CONDUCTIVE CONNECTION STRUCTURE, AND ELECTRONIC CIRCUIT COMPONENTS AND METHOD OF MANUFACTURING THE SAME

A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid. The apparatus comprises: a disk-shaped bottom plate secured to the top part of a vertical drive shaft; a porous body arranged on the upper surface of the outer periphery of the bottom plate and allowing only the plating liquid to pass therethrough; a contact ring arranged on the upper surface of the porous body to conduct electricity; a hollow cover including a truncated cone cover with an opening at its upper central portion and a hollow cylinder of the same diameter as that of the opening attached to the upper end of the truncated cone cover, the upper end portion of the hollow cylinder being folded back on the inner wall side thereof; a rotatable processing chamber formed so as to hold the porous body and the contact ring between the outer periphery of the hollow cover and the bottom plate; a supply pipe to supply the plating liquid from the opening into the processing chamber; a container to receive the plating liquid scattered from the pores of the porous body; a discharge pipe to discharge the plating liquid collected in the container; and an electrode inserted from the opening to contact the plating liquid.

Method and device for manufacturing conductive particles

The invention provides a film composition comprising a thermoplastic polymer having a melt flow rate of 20 to 2000 (g/10 min), and a flame-retardant, and a self-extinguishing laminated film comprising at least two thermoplastic polymer films, at least one of the thermoplastic polymer films being a meltable film prepared from the composition.

Self-extinguishing laminated film

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Shiga, Japan

Yoshiaki Kodera