Nikon Corporation

Yoshiaki Kito

Masaki Kato

Masakazu Hori

Hiroshi Shirasu

Kei Nara

Isao Sugaya

Masanori Arai

Tatsuo Fukui

Kazuhiro Suzuki

Minoru Fukuda

Hajime Mitsuishi

Masaki Tsunoda

Masahiro Yoshihashi

Daisuke Yuki

Mikio Ushijima

Yosuke Hayashida

Eiji Ariizumi

Masanori Aramata

Naoto Kiribe

To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.

Substrate bonding apparatus and substrate bonding method

An exposure device that draws a pattern on a substrate by shining a beam from a light source device on substrate and scanning the beam in a main scanning direction while varying the intensity of beam according to pattern information, including: a scanning unit having a beam scanning unit that includes a polygonal mirror whereby the beam is oriented to scan the beam, and light detector for photoelectric detection of reflected light generated when beam is shined on substrate; an electro-optical element for controlling the beam's intensity modulation according to pattern information such that at least part of second pattern to be newly drawn is drawn on top of at least part of first pattern formed on substrate; and a measurement unit measuring relative positional relationship between the first and second pattern on the basis of a detection signal output by the detector while second pattern is drawn on substrate.

Pattern drawing device, pattern drawing method, and method for manufacturing device

A processing system and a device manufacturing method that can perform manufacturing of an electronic device without stopping the entire manufacturing system, even when the processing state actually implemented on a sheet substrate by a processing device differs from the target processing state. A processing system for sequentially conveying a long, flexible sheet substrate along a length direction to each of a first through a third processing device to form a predetermined pattern on the sheet substrate, wherein the first through the third processing devices implement a predetermined process relating to the sheet substrate according to setting conditions set to each processing device, and when at least one from among the states of the actual processing implemented on the sheet substrate by each of the first through the third processing devices exhibits a processing error relative to a target processing state, changes other setting conditions, separate from the setting conditions exhibiting the processing error, according to the processing error.

Processing system and device manufacturing method

Substrates are aligned and then bonded to each other. A substrate bonding apparatus includes a deformer that deforms at least a first one of two substrates that are to be bonded to each other in order to correct misalignment between the two substrates, a holder that holds the deformed first substrate in the deformed state achieved by the deformer, a transporter that transports the holder from a position at which the deformed first substrate is held by the holder while the first substrate remains deformed, and a bonder that bonds the first substrate that has been transported by the transporter to the second substrate. In the above-described substrate bonding apparatus, while the first substrate is not held by the holder, the deformer may deform the holder from a first state to a second state that is more deformed than the first state, and while the first substrate is held by the holder, the deformer may reduce the amount of the deformation of the holder to less than the amount of the deformation of the second state to deform the first substrate.

Substrate bonding apparatus, substrate holding apparatus, substrate bonding method, substrate holding method, multilayered semiconductor device, and multilayered substrate

A detection method of detecting a position of an uppermost substrate of a plurality of substrates stacked on each other includes applying illumination to a region covering a portion of an edge of the uppermost substrate and a portion of a lower substrate stacked with the uppermost substrate, identifying a position of the edge of the uppermost substrate based on a position of a step-like portion present in the region due to a step formed between the uppermost substrate and the lower substrate, and identifying a position of the uppermost substrate based on the position of the edge of the uppermost substrate.

Detection method and detection apparatus

Growing community of inventors

Kamakura, Japan

Yoshiaki Kito