Kabushiki Kaisha Toshiba

Yoshiaki Kawamonzen

Masayuki Oba

Yoshiyuki Kamata

Yasuaki Ootera

Satoshi Mikoshiba

Naoko Kihara

Takeshi Okino

Shigeru Matake

Tomoyuki Maeda

Takuya Shimada

Shigeru Machida

Akiko Yuzawa

Hiroyuki Hieda

Rumiko Hayase

Norikatsu Sasao

Ryosuke Yamamoto

Toshio Nakayama

Koji Asakawa

Naomi Shida

Toru Ushirogouchi

Shuzi Hayase

Makoto Nakase

Yukihiro Mikogami

Yasushi Mori

An imprint method according to this embodiment includes preparing a mold having a recessed portion, filling the recessed portion with a mold non-reactive material, pressing the mold against a resist which is applied on a base material, curing the resist in a state that the mold is pressed, and separating the mold from the base material. The mold non-reactive material is a material which does not chemically react with a material of the mold. By curing of the resist, the resist and the mold non-reactive material are coupled. When the mold is separated from the base material, the resist and the mold non-reactive material are left on the base material.

Imprint method

In one embodiment, a method of manufacturing a mold includes: forming a first layer having an affinity to a second polymer on a substrate having an affinity to a first polymer; forming first and second openings in the first layer; filling a resist in the second openings and hardening the resist to obtain a hardened resist; and forming a second layer containing a block copolymer and causing it to self-assemble.

Method of manufacturing mold

A pattern forming method according to an embodiment includes: forming a pattern film on a first substrate, the pattern film having a concave-convex pattern, the pattern film being made of a material containing a first to-be-imprinted agent; forming a material film on a second substrate, the material film containing a second to-be-imprinted agent having a higher etching rate than an etching rate of the first to-be-imprinted agent; transferring the concave-convex pattern of the pattern film onto the material film by applying pressure between the first substrate and the second substrate, with the pattern film being positioned to face the material film, and by curing the second to-be-imprinted agent; detaching the first substrate from the pattern film; and removing the material film by etching, to leave the pattern film on the second substrate.

Pattern forming method

Several novel polyimide materials are disclosed. One example is a polyimide material comprising heterocyclic polyimide having an unit represented by the following general formula (1): 

Polyimide optical materials, polyimide precursor solutions and optical waveguide elements

Several novel polyimide materials are disclosed. One example is apolyimide material comprising heterocyclic polyimide having an unit represented by the following general formula (1): 

Disclosed is a developing solution for a photosensitive polyimide, which consists of an aqueous solution of an amine compound having a base dissociation index pKb &lsqb;&equals;&minus;log (Kb)&equals;&minus;log (Kw/Ka)&equals;14&minus;pKa, where Kb is a base dissociation constant, Ka is acid dissociation constant of a proton complex, pKa is an acid dissociation index of a proton complex&equals;&minus;log (Ka), and Kw is an ion product of water&equals;1&times;10,&rsqb; of 5 to 8 within an aqueous solution of 25&deg; C.

Developing solution and method of forming polyimide pattern by using the developing solution

A negative photosensitive resin composition, which comprises a thermosetting polymer precursor which can be cured through cyclodehydration upon heating, and a photosensitive heat cure accelerator. This photosensitive heat cure accelerator may be, a compound having a protective substituent group which can be eliminated upon irradiation of light, an N-oxide compound which is capable of exhibiting a heat cure accelerating property through a transition of an oxide group thereof upon irradiation of light, or a compound which is capable of exhibiting a heat cure accelerating property through generation of an acid upon irradiation of light. Further, this photosensitive heat cure accelerator may be formed of a combination of a latent heat cure accelerator which is capable of changing into a compound exhibiting a heat cure accelerating property through a reaction with an acid and a photo-acid generating agent which is capable of generating an acid upon irradiation of light.

Negative photosensitive resin composition, method of forming a pattern and electronic parts

A negative photosensitive polymer composition, which comprises a thermosetting polymer precursor which can be cured through cyclodehydration upon heating, and a photosensitive heat cure accelerator which is capable of accelerating a curing upon irradiation of light (cyclodehydration accelerating property). This photosensitive heat cure accelerator may be a compound which is capable of increasing molecular weight and raising volatilization temperature upon irradiation of light, or a compound which is capable of generating a carboxyl group upon irradiation of light thereby exhibiting a heat cure-accelerating property, and is formed of an aromatic hydrocarbon or aromatic heterocyclic compound having at least one hydroxyl group, substituted or unsubstituted amino group or mercapto group.

Negative photosensitive polymer composition of a thermosetting polymer

A photosensitive composition comprising, an oligomer having a backbone chain comprising an alicyclic skeleton and/or a conjugated polycondensed aromatic skeleton, the backbone chain being acid-decomposable or hydrolyzable, and a photo-acid-generating agent.

Transparent resin, photosensitive composition, and method of forming a

A positive photosensitive polymer composition, which comprises a thermosetting polymer precursor which can be cured through cyclodehydration upon heating, and a photosensitive cure accelerator which can be inactivated of its cure accelerating property by irradiation of light.

Positive photosensitive polymer composition, method of forming a pattern

A polyimide precursor composition, which comprises, a polyamic acid having a repeating unit represented by the following general formula (PA), and at least one kinds of cure accelerator selected from the group consisting of a substituted or unsubstituted nitrogen-containing heterocyclic compound exhibiting an acid dissociation index 'pKa' of a proton complex ranging from 0 to 8 in an aqueous solution thereof, or an N-oxide compound of said nitrogen-containing heterocyclic compound (AC1), a substituted or unsubstituted amino acid compound (AC2), and an aromatic hydrocarbon compound or an aromatic heterocyclic compound having a molecular weight of 1,000 or less and two or more hydroxyl groups (AC3): ##STR1## wherein .phi. is a quadrivalent organic group, .phi. is a bivalent organic group, R is a substituted or unsubstituted hydrocarbon group, organosilicic group or hydrogen atom.

Polyimide precursor composition, method of forming polyimide film,

A polyimide precursor having a molecular structure obtained by polymerizing (a) 0.97 to 1.03 molar equivalent of a diamine component containing 0.40 molar equivalent or more of aromatic diamine compound represented by the general formula (DA1), and (b) an acid anhydride component containing (1-n.sub.1 /2) molar equivalent of a tetracarboxylic dianhydride and n.sub.1 molar equivalent of at least one selected from the group consisting of maleic anhydride and maleic derivative anhydride, wherein n.sub.1 ranges from 0.02 to 0.40. ##STR1##

Polyimide precursor, bismaleimide-based cured resin precursor and

Hydrazone compound useful as an excellent organic nonlinear optical material and a highly sensitive coloring chelation agent, represented by the following formula (1): ##STR1## wherein Ar is a substituted or an non-substituted 2-imidazolyl group, a 4-imidazolyl group, 3-pyrazolyl group, 3-pyridazinyl, 2-pyrimidinyl, 4-pyrimidinyl, 2-quinolyl, 1-isoquinolyl, 3-isoquinolyl, 1-phthalazinyl, 2-quinazolinyl, 2-benzimidazolyl, 2-benzothiazolyl, or 2-thiazolyl group,

Hydrazone compound and the use thereof

Disclosed is an organic nonlinear optical material made of heterocyclic compound which is represented by general formula (I) shown below. ##STR1## wherein Z.sub.1 is O, S, Se, Te, SO.sub.2 group or NR.sub.1 group; Z.sub.2 is N or CR.sub.2 group; Y is O, S or NR.sub.3 group; X is CR.sub.4 R.sub.5 group, NR.sub.6 group, O or S; and R, R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, and R.sub.6 may be identical to or different from each other, and each of them is heterocyclic group, aromatic hydrocarbon group, aliphatic hydrocarbon group or alicylic hydrocarbon group, which may be unsubstituted or substituted, characteristic group or H, where R.sub.4 and R.sub.5 may jointly form a carbocyclic or a heterocyclic ring.

Growing community of inventors

Machida, Japan

Yoshiaki Kawamonzen