Sharp Kabushiki Kaisha Corporation

Yoshiaki Itakura

Masahiro Konishi

Shin Itoh

Hiroyuki Nokubo

Hiroshi Yamashita

Ippei Yamaguchi

An electrode pattern () formed on a ceramics layer () in a substrate for a light emitting device (circuit board ()) of the present invention includes a first metal layer (), a second metal layer (), and an electrode terminal unit (), and the thickness of a part at which the electrode terminal unit () is not formed in the electrode pattern () is at least equal to or greater than 35 &#x3bc;m. Accordingly, it is possible to suppress heat resistance to be low.

Substrate for light emitting device and manufacturing method of substrate for light emitting device

A substrate includes a base made of a metal material, a thermally conductive, light-reflective ceramic insulating layer, and a buffer layer formed between the base and the ceramic insulating layer and having a smaller linear expansion coefficient than the base.

Light-emitting device substrate, light-emitting device, and method for manufacturing light-emitting device substrate

In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate () includes an intermediate layer () containing ceramic which is formed on the surface of the aluminum base () by using an aerosol deposition method.

Substrate for light emitting devices and light emitting device

Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate () for a light emitting device includes: a first insulating layer () having thermal conductivity which is formed on a surface of one side of a metal base (); a wiring pattern () which is formed on the first insulating layer (); and a second insulating layer () having light reflectivity which is formed on the first insulating layer () and on some parts of the wiring pattern (), so that some parts of the wiring pattern () are exposed, in which the first insulating layer () is a layer of ceramic formed by thermal spraying.

Growing community of inventors

Sakai, Japan

Yoshiaki Itakura