Asahi Glass Company, Limited

Agc Inc.

Yoshiaki Higuchi

Manabu Suhara

Takeshi Kawasato

Kazuya Hiratsuka

Naoki Yoshida

Naruaki Tomita

Hiroshi Aruga

Katsuji Ikeda

Seigo Kotera

Tetsuji Shimohira

Satoru Hommura

Atsushi Funaki

Wataru Kasai

Ichiro Terada

Sho Masuda

Takamichi Ishikawa

Daisuke Taguchi

Satoru Kuroki

Sadao Kanetoku

Tsuyoshi Iwasa

Hiroshi Shimoda

Haruhisa Miyake

Kohji Suzuki

Shigeru Aida

Hiroki Kamiya

Kazuo Umemura

Hiromitsu Kusano

Takashi Sato

Takuya Nakao

Shintaro Fukunaga

Yasumasa Yukawa

Yoshihiko Saito

Masakazu Ataku

Yukio Jitsugiri

Satoshi Otsugu

Tamao Okuya

Junetsu Nakamura

Takatoshi Yaoita

Yoshihiko Saitoh

Tetsuya Hasegawa

Yuya Horiguchi

A film includes a copolymer having a tetrafluoroethylene-based unit and an ethylene-based unit, in which the film has a haze of from 1.2% to 8.0%, an ultraviolet reflectance of less than 17.0%, and a thickness of from 250 to 400 μm.

Film and method of producing the same

To provide a laminate which has a heat sealing property, a barrier property and mechanical strength, of which elution of impurities from the surface to be in contact with a chemical solution is suppressed, and of which peeling and the like hardly occur at the sealed portion of a bag and at the interfaces between the layers of the laminate when exposed to high temperature, a bag using it and a lithium ion battery. A laminatecomprising a first layercontaining a fluororesin, a second layercontaining a barrier material, a third layercontaining a fluororesin and a fourth layercontaining a polyamide in this order, wherein each of the fluororesin in the first layerand the fluororesin in the third layeris a fluororesin having a melting point of from 160 to 230&#xb0; C. and having adhesive functional groups.

Layered body, bag and lithium ion cell

To provide a process for producing a film excellent in water vapor barrier property, tensile elongations, and transparency. A resin material containing polychlorotrifluoroethylene (PCTFE) is melted and extruded into a film from an extrusion die, the extruded product is brought into contact with a cooling roll having a surface temperature of at most 120&#xb0; C. in a state such that the surface temperature of the extruded product is higher than the crystallization temperature of PCTFE to form a film web, and the film web is subjected to heat treatment at from 80 to 200&#xb0; C. to obtain a film.

Method for manufacturing film, film, laminated body, and packaging material

To provide a resin film which comprises an ethylene/tetrafluoroethylene copolymer and which is to be used as, for example, a rubber plug lamination film to prevent breakage at the time of producing a laminated rubber plug. The resin film comprises an ethylene/tetrafluoroethylene copolymer and is characterized in that the product of the value of the endothermic peak height &#x394;H (mW/mg) obtained by its DSC-analysis and the haze (%) measured at a thickness of 100 &#x3bc;m, is from 0.1 to 0.2 (mW/mg&#xb7;%).

Resin film and process for its production

To provide a method for producing a fluororesin film, whereby defects due to deterioration (such as fish-eyes due to gelation) of a melt-processable fluororesin are less likely to occur during the production. A method for producing a fluororesin film, which comprises extruding a fluororesin material containing a melt-processable fluororesin through an extruder die, wherein the temperature of the extruder die is from 305 to 355&#xb0; C., and the average flow velocity vof the fluororesin material as obtained by v=Q/A, is at least 1&#xd7;10m/sec. Here, when the distance from the flow inletof the extruder die to the end of the manifoldof the extruder die is set to be x=1, Qis the flow rate (m/sec) of the fluororesin material flowing in the manifoldat a position of x=0.95 from the flow inlet, and Ais the cross-sectional area (m) of the manifoldat a position of x=0.95 from the flow inlet

Method for producing fluororesin film

An ethylene/tetrafluoroethylene copolymer sheet obtained by extrusion, has R/d, wherein Ris an in-plane phase difference [unit: nm]and d is a thickness, [unit: nm], of at most 3.0&#xd7;10, and a thickness of more than 300 &#x3bc;m. The ethylene/tetrafluoroethylene copolymer sheet preferably has a thickness of from 305 to 3,000 &#x3bc;m . A process for producing an ethylene/tetrafluoroethylene copolymer sheet includes melting an ethylene/tetrafluoroethylene copolymer to obtain a melt, continuously extruding the melt through a die for shaping the melt to a sheet, and letting the sheet pass between two rolls. One of the two rolls is a rigid roll, and the other is an elastic roll. The two rolls are pressed under a linear pressure of from 0.1 to 1,000 N/cm.

Ethylene-tetrafluoroethylene copolymer sheet and method for producing same

To provide a film or sheet and a screen excellent in visibility of a projected image, in see-through properties when an image is not projected and in bending resistance. A single-layer film or sheet comprising a fluororesin, a light-scattering agent and a light absorbing agent, characterized in that the light-scattering agent is at least one light-scattering agent selected from the group consisting of a titanium oxide-containing pigment, a zinc oxide-containing pigment and a cerium oxide-containing pigment, and the content thereof is from 0.01 to 0.175 g/m, and the light absorbing agent is at least one light absorbing agent selected from the group consisting of carbon black, a black interference aluminum pigment, black iron oxide and titanium black, and the content thereof is from 0.0005 to 0.035 g/m.

Film or sheet, and screen

A mold release film, which is adapted to be disposed on the cavity surface of a mold to form a resin-encapsulated portion by encapsulating a semiconductor element of a semiconductor device with a curable encapsulation resin, has a tensile modulus of elasticity of from 10 to 24 MPa at 132&#xb0; C. as measured in accordance with JIS K 7127, and a peak peel resistance of at most 0.8 N/25 mm.

Mold release film and method of process for producing a semiconductor device using the same

A process of sealing a semiconductor substrate by contacting the semiconductor substrate with a surface of a release layer (I) of a gas barrier release film that is in the form of a mold, which includes vacuum suction; injecting a sealing resin between the semiconductor substrate and the mold; and releasing said mold from said semiconductor substrate having said sealing resin present thereon, where the gas barrier release film has a release layer (I), which has excellent releasability; a plastic support layer (II) supporting the release layer; and a metal or a metal oxide gas restraint layer (III), present between the release layer and the support layer, where the gas barrier release film exhibits a xylene gas permeability of at most 5&#xd7;10(kmol m/(s&#xb7;m&#xb7;kPa)) at 170&#xb0; C., and a surface of said release layer (I) has an arithmetic surface roughness of from 0.15 to 3.5 &#x3bc;m, exhibiting a satin-finish.

Release film for semiconductor resin molds

A laminated sheet comprising a woven or nonwoven fabric comprising glass fibers fixed by a binder, and a fluororesin film laminated on each other, wherein the binder contains a copolymer (A) having repeating units (a) based on at least one fluoromonomer selected from the group consisting of tetrafluoroethylene, chlorotrifluoroethylene and hexafluoropropylene, and repeating units (a) based on at least one non-fluoromonomer selected from the group consisting of a vinyl ether, a vinyl ester, an isopropenyl ether, an isopropenyl ester, an allyl ether and an allyl ester.

Laminated sheet

The present invention provides an ethylene/tetrafluoroethylene copolymer composition having a high melt flowability while maintaining satisfactory mechanical properties in the obtainable molded product are maintained. The ethylene/tetrafluoroethylene copolymer composition (C) has a melt viscosity of from 80 to 500 Pa&#xb7;s, preferably from 100 to 300 Pa&#xb7;s and a tensile elongation of from 200 to 500%, preferably from 350 to 450%. The copolymer composition (C) is may be obtained by melt kneading an ethylene/tetrafluoroethylene copolymer (A) having a low melt viscosity of from 60 to 400 Pa&#xb7;s, preferably from 80 to 300 Pa&#xb7;s and an ethylene/tetrafluoroethylene copolymer (B) having a melt viscosity higher than this i.e. from 600 to 10,000 Pa&#xb7;s, preferably from 1,000 to 7,000 Pa&#xb7;s in a mass ratio of (A)/(B)=50/50 to 99/1, preferably (A)/(B)=60/40 to 97/3.

Ethylene/tetrafluoroethylene copolymer composition

An electrolyte membrane characterized by comprising a porous body formed from a melt-moldable fluororesin and having interconnected pores and an ion exchange resin with which the interconnected pores are filled, is provided. Specifically, the porous body is formed, for example, from an ethylene/tetrafluoroethylene copolymer, a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer, a tetrafluoroethylene/hexafluoropropylene copolymer, a tetrafluoroethylene/[CF&#x2550;CF&#x2014;(OCFCFY)&#x2014;O&#x2014;(CF)&#x2014;SOH] copolymer (wherein Y is a fluorine atom or a trifluoromethyl group, a is an integer of 0 to 3, b is an integer of from 0 to 12, and c is 0 or 1, provided that when b=0, C=0), or the like. An electrolyte membrane reinforced by such a porous body has high mechanical strength even if it is thin, and is excellent in dimensional stability when hydrated, and a polymer electrolyte fuel cell with a membrane-electrode assembly having the electrolyte membrane provides a high output and is excellent in durability.

Electrolyte membrane, process for its production and polymer electrolyte fuel cell

A laminate for a printed wiring board having a laminate structure comprising an electrical insulator layer (A) and an electrical conductor layer (B) bonded directly to each other, wherein the electrical insulator layer (A) is formed of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and a polymerizable unsaturated bond in amounts of (a) being from 50 to 99.89 mol %, (b) being from 0.1 to 49.99 mol % and (c) being from 0.01 to 5 mol %, based on ((a)+(b)+(c)), and the electrical conductor layer (B) has a surface roughness of at most 10 &#x3bc;m on the side being in contact with the electrical insulator layer (A). The laminate for a printed wiring board is excellent in signal response in a high frequency region.

Laminate for printed wiring board

To provide a laminate for a flexible printed wiring board excellent in signal response in the high frequency region. A laminate for a flexible printed wiring board having a three-layer laminated structure where a reinforcing layer (A), an electrical insulator layer (B) and an electrical conductor layer (C) are laminated in this order, wherein the electrical insulator layer (B) is made of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and the electrical conductor layer (C) has a surface roughness of at most 10 &#x3bc;m on the side being in contact with the electrical insulator layer (B). The laminate for a flexible printed wiring board is excellent in signal response in the high frequency region and excellent in flex resistance.

Laminate for flexible printed wiring board

An electric double layer capacitor which has a low internal resistance and a large capacitance per unit volume and which is excellent in the voltage retention property, is provided. In a non-aqueous type electric double layer capacitor having a separator disposed between a positive electrode and a negative electrode made of carbonaceous electrodes, the separator comprises a sheet having a thickness of from 10 to 100 &#x3bc;m and a porosity of from 50 to 90% and a netted spacer having a thickness of from 10 to 100 mm, a numerical aperture of from 30 to 85% and an opening of from 50 to 350 mesh, laminated one on the other.

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Chiyoda-ku, Japan

Yoshiaki Higuchi