Toyoda Gosei Co., Ltd.

Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Kioxia Corporation

Yoshiaki Goto

Kensaku Honda

Yuji Sato

Masashi Hotta

Akira Yamashita

Takashi Iida

Kazuaki Bito

Eiji Sato

Yasushi Masuda

Naohiko Ishiguro

Takashi Imoto

Masao Kino

Yuusuke Takano

Takeshi Watanabe

Akira Suzuki

Yusuke Akada

Hideo Aoki

Koji Kawamura

Toru Koyama

Yasushi Okada

Hitoshi Iida

Satoshi Tsukiyama

Takuya Hiraiwa

Masaaki Okuhara

Koji Shibayama

Yuji Matsuzaki

Michihisa Asaoka

Hitoshi Kawabe

Yoshinari Takei

Yoshihiko Hishiki

Kikuyo Izoe

Yuji Karakane

Yoshinori Okayama

Akihiko Yanagida

Naoki Nimi

Toshihiro Hosoi

According to one embodiment, a semiconductor device includes a wiring board that has a first surface and a second surface opposed to the first surface, a semiconductor chip provided on the first surface, external connection terminals provided on the second surface, a sealing resin layer provided on the first surface, and a conductive shield layer that covers at least a portion of a side surface of the wiring board and the sealing resin layer. The wiring board includes a first ground wire that is electrically connected to the conductive shield layer, and a second ground wire that is electrically connected to the conductive shield layer and is electrically insulated from the first ground wire.

Semiconductor device and method of inspecting the same

A lead frame includes a first outer lead portion and a second outer lead portion which is arranged to oppose to the first outer lead portion with an element-mounting region between them. An inner lead portion has first inner leads connected to the first outer leads and second inner leads connected to the second outer leads. At least either the first or second inner leads are routed in the element-mounting region. An insulation resin is filled in the gaps between the inner leads located on the element-mounting region. A semiconductor device is configured with semiconductor elements mounted on both the top and bottom surfaces of the lead frame.

Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame

A semiconductor device of an embodiment includes a substrate, first, second, third, and fourth semiconductor elements, a first wiring layer, and first and second bonding wires. The third semiconductor element is on the substrate between the first resin element and the second resin element. The first wiring layer is on the first semiconductor element, is connected to the first semiconductor element, and is connected to the substrate by the first bonding wire. The fourth semiconductor element is on the first wiring layer and is connected to the first wiring layer by a second bonding wire. The first bonding wire is at a side of the first wiring layer other than a side farthest from the second wiring layer.

Semiconductor device

Semiconductor memory device

According to one embodiment, a semiconductor device of an embodiment includes a substrate, a metal plate having a main portion having a first width in a first direction and a second width in a second direction orthogonal to the first direction, a first semiconductor chip located between the metal plate and the substrate, the first semiconductor chip having a third width in the first direction and a fourth width in the second direction, and a second semiconductor chip located between the first semiconductor chip and the substrate, wherein the first width is smaller than the third width, and the second width is smaller than the fourth width.

Semiconductor device package having a mounting plate with protrusions exposed from a resin material

A side airbag device includes a folded-up airbag and a limitation member disposed around the airbag for constraining the airbag from protruding forward at airbag deployment. The limitation member is formed of a flexible sheet member into a band shape, and is joined to the folded-up airbag by the opposite end regions. The limitation member includes a loose region which is arranged around the folded-up airbag in such a manner as to be remote from the folded-up airbag. The loose region is disposed on a side of the folded-up airbag towards which the airbag protrudes. The loose region includes a tearable region in the region in a deployment direction of the airbag.

Side airbag device

Semiconductor package including a device and lead frame used for the same

An airbag in an uninflated-and-spread form includes a rear-lower inflation portion and a front-upper inflation portion. The airbag is stored in a first vehicle seat. The vehicle seat adjacent to the first vehicle seat is a second vehicle seat. The front-upper inflation portion includes at least three bend portions, which are arranged in a flowing direction of inflation gas. A form between the uninflated-and-spread form and the storage form is a transitional form. In the transitional form, the bend portions are each bent relative to the adjacent bend portion and rolled toward the second vehicle seat relative to the rear-lower inflation portion such that the closer a bend portion is to the downstream end, the more inward the bend portion is located. In the transitional form, the upper end of the most upstream bend portion is connected to the upper end of the rear-lower inflation portion.

Far-side airbag apparatus and method for folding airbag

A side airbag system includes: an airbag; and a wrapping material that is disposed around a folded-up airbag body into which the airbag is folded so as to prevent the collapse of neatly arranged folds of the folded-up airbag body, the folded-up airbag body being configured as an elongated body having an external shape that is disposed so that a longitudinal direction thereof substantially follows an up-to-down direction, wherein: the wrapping material is disposed so as to wrap around the folded-up airbag body, including a brake planned portion capable of breaking when the airbag inflates which is provided on a front surface side of the folded-up airbag body so as to substantially follow the up-to-down direction; and the break planned portion comprises a low-strength portion where a break strength thereof is set low and a high-strength portion where the break strength is set high.

Side airbag system

Semiconductor device and lead frame used for the same

A semiconductor device includes a substrate, a magnetic shield plate, a semiconductor element, a sealing layer, and a magnetic shield film. The magnetic shield plate includes a plate portion disposed along the substrate, inclined portions extending in obliquely upward directions from opposite edges of the plate portion, and arcuate portions disposed at tip ends of the inclined portions. The semiconductor element is mounted on the plate portion. The sealing layer seals the semiconductor element and the plate portion and the inclined portions of the magnetic shield plate. At least a part of each of the arcuate portions is exposed on a surface of the sealing layer. The magnetic shield film covers an upper surface of the sealing layer and is in contact with each of the arcuate portions.

Semiconductor device and method of manufacturing the same

An airbag apparatus includes an airbag, a retainer secured to the airbag, and an elongated inflator attached to the retainer. The inflator discharges gas for inflating the airbag. The retainer includes an attaching protrusion, which protrudes in a direction intersecting an axis of the inflator and secures the retainer to a vehicle together with the airbag. The inflator includes an attaching protrusion, which protrudes in the direction intersecting the axis and secures the inflator to the vehicle together with the retainer.

Airbag apparatus and method for assembling the same

In a manufacturing method of a semiconductor device according to an embodiment, a plurality of semiconductor packages each including a semiconductor chip mounted on a wiring board and a sealing resin layer as objects to be processed, and a tray including a plurality of housing parts are prepared. A depressed portion having a non-penetrating shape or a penetrating shape is formed in the housing part. The semiconductor packages are disposed in the plural housing parts respectively. By sputtering a metal material on the semiconductor package housed in the tray, a conductive shield layer is formed.

Manufacturing method of a conductive shield layer in semiconductor device

An inflation portion of an airbag main body is divided into a first inflation chamber, a second inflation chamber in front of and adjacent to the first inflation chamber with a vertical partition in between, and a third inflation chamber below the first inflation chamber with a lateral partition in between. The vertical partition has a pressure regulator valve. Before the first inflation chamber restrains an occupant, the pressure regulator valve restricts flow of inflation gas from the first inflation chamber to the second inflation chamber. When the first inflation chamber restrains the occupant, the pressure regulator valve opens in response to a change in the tensed state of the vertical partition due to the applied external force generated by the restraint, thereby cancelling the restraint. The lateral partition has a check valve, which restricts flow of inflation gas from the third inflation chamber to the first inflation chamber.

Side airbag apparatus

Growing community of inventors

Kiyosu, Japan

Yoshiaki Goto