Unitika Ltd.

Ricoh Company, Ltd.

The United States of America as Represented by the Administrator of the

Other

United States of America as Represented by the Administrator of Nasa

Nippon Kayaku Kabushiki Kaisha

Doryokuro Kakunenryo Kaihatsu Jigyodan

Bridgestone Corporation

Toda Kogyo Corporation

Unitka Ltd.

Souichiro Kishimoto

Tetsuro Toda

Yoshiaki Echigo

Tsutomu Sakaida

Shigeru Takaragi

Keiichi Asami

Hisayasu Kaneshiro

Akira Shigeta

Terry L St Clair

Takeshi Yoshida

Erik S Weiser

Mutsunori Yamao

Tadashi Ishikura

Isao Tomioka

Yoshiaki Iwaya

Yuki Yamada

Tatsuya Morikita

Yoshiyuki Suematu

Ritsuko Shidei

Toshiyuki Kabata

Toshiyuki Ohsawa

Takeshi Nakano

Hideki Takahashi

Mikio Furukawa

Makoto Uchida

Hiroshi Yamada

Shoji Okamoto

Keiichiro Otomura

Akio Sasaki

Yosuke Sugimoto

Katsuo Inoue

Kiyotaka Nakanishi

Yoshikazu Ogura

Hitoshi Kondo

Akira Ito

Eiichi Kurita

Roberto J Cano

Toshiyuki Hakata

Kazuo Fujioka

Okitoshi Kimura

Shigeru Moteki

Ryoichi Hasegawa

Hiroshi Kajimaru

Takuo Yasuda

Masato Wada

Minoru Noji

Minoru Saito

Jusirou Eguchi

Jun-ichi Mori

Seiichi Hayashi

Jushiro Eguchi

Takahiro Ono

Tsuneyuki Ohsawa

Yoshiaki Maekawa

Tutomu Sakaida

Minoru Saitou

Keitarou Seto

Azusa Yamagata

Tadao Nagai

Yoshiyuki Suematsu

Hirotaka Amimoto

Sakae Fujisaki

Kenichi Sugawara

Tuneyuki Ohsawa

An object is to provide a method for easily producing maleimide (MI) in which trace amounts of residual acid components as impurities in a crude MI are efficiently reduced, that is, the acid value is sufficiently reduced.

Production method of maleimide

An object of the present invention is to provide a bismaleimide (D-BMI) modified product in which an amino group of dimer diamine (DDA) is maleimidized, which has the good heat resistance, and has the sufficiently enhanced processability, and a method for producing the same. There are provided:

Bismaleimide modified product and method for producing the same

An object of the present invention, which was made to solve the problems above, is to provide a polyimide precursor resin composition superior in transparency allowing reduction of the residual volatile material rate during molding and giving a polyimide resin composition (e.g., polyimide film) superior in mechanical properties and transparency even when a cheaper polyamide-imide is used. The present invention relates to a polyimide precursor resin composition, comprising a polyamide-imide (A) containing a diamine monomer unit represented by the following formula (1) and a polyamic acid (B) containing at least one kind of monomer unit selected tetracarboxylic acid monomer units represented by the following formulae (2p) to (2r), wherein the haze of the film having a thickness of 40 &#x3bc;m obtained by imidation of the polyimide precursor resin composition is 4% or less: (wherein, R represents an alkylene group having 1 to 5 carbon atoms); 

Polyimide resin composition, polyimide precursor resin composition for the same, production method thereof, and polyimide film and production method thereof

The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 &#x3bc;m and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.

Substrate for flexible printed wiring board and method for manufacturing the same

A method for preparing a substrate for a flexible print wiring board having a polyimide based resin layer wherein a solution of a polyimide based resin precursor is directly applied on an electrically conducting material to form a polyimide based resin precursor layer and then the precursor layer is cured by heating to prepare a polyimide based resin layer, characterized in that a solution of a polyimide based resin precursor B, which is one of solutions of two types of polyimide based resin precursors, is directly applied on an electrically conducting material and then, on the resultant layer is applied a solution of a polyimide based resin precursor A which allows resolving the residual strain generated in the polyimide based resin formed by the curing of the above polyimide based resin precursor B.

Method for preparing substrate for flexible print wiring board, and substrate for flexible print wiring board

A polyimide precursor fibrid material which comprises a polyimide precursor that forms a polyimide having a property of no thermal melting when subjected to a ring closure reaction and which is substantially free from aprotic polar organic solvents, and polyimide paper, polyimide composite paper and polyimide composite board obtained therefrom. Since the inventive polyimide precursor fibrid material does not contain aprotic polar organic solvents, a polyimide paper product having excellent strength can be obtained from the polyimide precursor fibrid material, and a polyimide composite paper product and a polyimide composite board both consisting of uniformly dispersed components and having excellent strength can be obtained from the polyimide precursor fibrids and other staple fibers.

Polyimide precursor fibrid, polyimide paper, polyimide composite paper and polyimide composite board obtained therefrom, and process for producing the fibrid and the paper products

A shaped article composed of an aromatic polyimide has a hollow, essentially spherical structure and a particle size of about 100 to about 1500 &mgr;m, a density of about 1 to about 6 pounds/ft,and a volume change of 1 to about 20% by a pressure treatment of 30 psi for 10 minutes at room temperature. A syntactic foam, made of a multiplicity of the shaped articles which are bonded together by a matrix resin to form an integral composite structure, has a density of about 3 to about 30 pounds/ft,and a compression strength of about 100 to about 1400 pounds/in,.

Hollow polymide microspheres

High quality films, preimpregnated tape (prepegs) and composites have been fabricated from polyimide precursor &ldquo;salt-like&rdquo; solutions. These &ldquo;salt-like&rdquo; solutions have a low viscosity (5,000 to 10,000 cp) and a high solids content (50-65% by weight) and can be coated onto reinforcing fiber to produce prepegs with excellent tack and drape at 12-15% residual solvent (&tilde;4-6% water from thermal imidization reaction). The processing of these types of prepegs significantly overcomes solvent removal problems and allows excellent fiber wet out. In addition, the physical characteristics of the polyimide precursor &ldquo;salt-like&rdquo; solutions permits processing into high-performance materials through the use of standard prepregging and composite fabrication equipment. The resultant composites are of high quality.

Films, preimpregnated tapes and composites made from polyimide &ldquo;Salt-like&rdquo; Solutions

A polyimide precursor solid residuum is an admixture of an aromatic dianhydride or derivative thereof and an aromatic diamine or dervative thereof plus a complexing agent, which is complexed with the admixture by hydrogen bonding. The polyimide precursor solid residuum is effectively employed in the preparation of polyimide foam and the fabrication of polyimide foam structures.

Polyimide precursor solid residuum

A mechanically undensified aromatic polyimide foam is made from an aromatic polyimide precursor solid residuum and has the following combination of properties: a density according to ASTM D-3574A of about 0.5 pounds/ft.sup.3 to about 20 pounds/ft.sup.3 ; a compression strength according to ASTM D-3574C of about 1.5 psi to about 1500 psi; and a limiting oxygen index according to ASTM D-2863 of about 35% oxygen to about 75% oxygen at atmospheric pressure. The aromatic polyimide foam has no appreciable solid inorganic contaminants which are residues of inorganic blowing agents. The aromatic polyimide which constitutes the aromatic polyimide foam has a glass transition temperature (Tg) by differential scanning calorimetry of about 235.degree. C. to about 400.degree. C.; and a thermal stability of 0 to about 1% weight loss at 204.degree. C. as determined by thermogravimetric analysis (TGA). The aromatic polyimide foam has utility as foam insulation and as structural foam, for example, for aeronautical, aerospace and maritime applications.

Aromatic polyimide foam

A polyimide precursor solution having a high concentration yet low viscosity, a polyimide coating film having satisfactory physical properties which is prepared from the polyimide precursor solution, and a process for producing a polyimide coating film using the polyimide precursor solution. The polyimide precursor solution has dissolved therein a specific salt of a diamine and a tetracarboxylic acid and/or a dicarboxylic acid-dialkyl ester in a high concentration, the diamine and the tetracarboxylic acid and/or the dicarboxylic acid-dialkyl ester being capable of forming a polyimide. Also disclosed is a polyimide coating film obtained by heating the solution to cause imidization and a process for producing the polyimide coating film.

Polyimide precursor solution, coating film obtained therefrom, and

A shaped article composed of an aromatic polyimide has a hollow, essentially spherical structure and a particle size of about 100 to about 1500 .mu.m, a density of about 1 to about 6 pounds/ft.sup.3 and a volume change of 1 to about 20% by a pressure treatment of 30 psi for 10 minutes at room temperature. A syntactic foam, made of a multiplicity of the shaped articles which are bonded together by a matrix resin to form an integral composite structure, has a density of about 3 to about 30 pounds/ft.sup.3 and a compression strength of about 100 to about 1400 pounds/in.sup.2.

Hollow polyimide microspheres

A shaped article composed of an aromatic polyimide has a hollow, essentially spherical structure and a particle size of about 100 to about 1500 .mu.m, a density of about 1 to about 6 pounds/ft.sup.3 and a volume change of 1 to about 20% by a pressure treatment of 30 psi for 10 minutes at room temperature. A syntactic foam, made of a multiplicity of the shaped articles which are bounded together by a matrix resin to form an integral composite structure, has a density of about 3 to about 30 pounds/ft.sup.3 and a compression strength of about 100 to about 1400 pounds/in.sup.2.

Growing community of inventors

Uji, Japan

Yoshiaki Echigo