Hitachi Automotive Systems, Ltd.

Yosei Hara

Morio Kuwano

Kinya Nakatsu

Yusuke Takagi

Akira Matsushita

Takahiro Shimura

Atsuo Nishihara

Keisuke Horiuchi

Masayoshi Takahashi

Keisuke Fukumasu

Akira Ishii

Haruki Hamada

It is an object of the present invention to enhance connection reliability of terminals while enhancing assembling performance. A power conversion device according to the present invention includes: a power semiconductor module having a power terminal; a capacitor module for supplying smoothed power to the power semiconductor module; and a mold bus bar in which a conductor part for electrically connecting the power semiconductor module and the capacitor module is sealed by a resin material, wherein the capacitor module has a positive capacitor terminal and a negative capacitor terminal, the power terminal, the positive capacitor terminal, and the negative capacitor terminal are formed such that the main surfaces of the terminals face in the same direction, and the mold bus bar has a first terminal contacting with the main surface of the power terminal, a second terminal contacting with the main surface of the positive capacitor terminal, and a third terminal contacting with the main surface of the negative capacitor terminal.

Power conversion device

To suppress reduction in resistance against vibrations, while reducing the number of components, a power conversion device including a power semiconductor module that converts a DC current into an AC current, a plate conductor that transfers the DC current or the AC current, a resin sealing material that seals the plate conductor, and an electric component that is used to control the power semiconductor module has the resin sealing material include a supporting member. The supporting member supports the electric component, and the plate conductor is buried in a portion of the resin sealing material that is disposed to face the electric component.

Power conversion device having bus bar with improved vibration resistance

An electric power conversion device includes a capacitor package. The capacitor package includes a first positive electrode bus bar that is connected to a positive electrode of the inverter circuit unit and connected to a smoothing capacitor. The capacitor package also includes a second positive electrode bus bar that is connected to a positive electrode on a battery side of the converter circuit unit and connected to the another smoothing capacitor. On a first side thereof the negative electrode bus bar directly overlaps the entire first positive electrode.

Electric power conversion device

A power converter includes a power semiconductor module, a first flow path forming body and a second flow path forming body that forms a housing space for storing the power semiconductor module and the first flow path forming body, in which the first flow path forming body is configured of a first side wall section, a second side wall section, and a bottom surface section, the first side wall section forms a first flow path space between one surface of the power semiconductor module and the first side wall section, the second side wall section forms a second flow path space between the other surface of the power semiconductor module and the second side wall section, and cooling refrigerant flows through the housing space, the first flow path space, and the second flow path space.

Power converter

A power conversion apparatus includes: a power semiconductor module (); a flow channel forming body () for housing the power semiconductor module (); and a cover () for fixing the power semiconductor module () to the flow channel forming body (), and the power semiconductor module () includes a power semiconductor element, main terminals () electrically connected to the power semiconductor element, and a case for housing the power semiconductor element, the cover () has a recessed portion () and an opening () provided in a bottom surface portion of the recessed portion (), the power semiconductor module () is placed to be fitted into the recessed portion (), the power semiconductor module () is fixed to the cover () so that the main terminals () pass through the opening (), the case and an inner wall of the recessed portion () have an airtight structure, and therefore prevents intrusion of a coolant into the power semiconductor module having a double-sided cooling structure and outflow of the coolant to outside of the module.

Power conversion apparatus

Power module for power inverter

Provided is a power conversion apparatus that includes a power semiconductor module, a smoothing capacitor module, an alternating-current bus bar, a control circuit unit to control the power semiconductor element, and a flow channel formation body to form a flow channel through which a cooling medium flows. The power semiconductor module has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion. A flow channel formation body external portion of the flow channel formation body has a first surface wall that faces the first heat dissipation portion with the flow channel therebetween, a second surface wall that faces the second heat dissipation portion with the flow channel therebetween, and a sidewall to connect the first surface wall and the second surface wall. The sidewall has an opening to insert the power semiconductor module into the flow channel.

Growing community of inventors

Hitachinaka, Japan

Yosei Hara