Hitachi Chemical Company, Ltd.

Other

Hitachi, Ltd.

Sharp Corporation

Hitachi Co., Ltd

Yorio Iwasaki

Toshiro Okamura

Shigeharu Arike

Kanji Murakami

Hidehiro Nakamura

Eiichi Shinada

Fujio Kojima

Yuichi Nakazato

Masami Yusa

Fumio Inoue

Shin Takanezawa

Yoshiki Sota

Akishi Nakaso

Yasushi Shimada

Yoshiaki Tsubomatsu

Toshio Yamazaki

Hiroshi Takahashi

Koji Miyata

Shigeki Ichimura

Masao Kanno

Hiroharu Kamiyama

Yasuhiko Awano

Eisaku Namai

Naoki Fukutomi

Kiyoshi Hasegawa

Kouichi Tsuyama

Hiroyoshi Yokoyama

Atsushi Nishimura

Yutaka Taniguchi

Nobuo Uozu

Toshirou Okamura

Mituo Teppozuka

Kousuke Takada

Hisaji Kobori

Wataru Shimizu

Tatsuya Amano

Noriyoshi Fukuoka

Saburo Amano

Hiroshi Takaahashi

A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package

A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Substrate for holding a chip of semi-conductor package, semi-conductor

A current protector comprising an organic resin-made insulating substrate, a pair of terminals formed at both ends of the insulating substrate, and an electrical conductor electrically connecting the terminals and having a thickness of 3-8 .mu.m and formed in or on the insulating substrate, is excellent in suppressing ignition and smoking at the time of blowing, and can be improved in clearing characteristics by various modifications.

Current protector

An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

Process for producing multiple wire wiring board

Multiple wire adhesive on a multiple wire wiring board

An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator

A coaxial conductor interconnection wiring board characterized by having at least one inner wall metallized conductive hole for connecting a conductive shield of coaxial conductor to a ground layer, or having connection metal layers for connecting ground layers or connecting the conductive shield to a ground layer, and an inner wall metallized conductive hole for connecting a central signal conductor of coaxial conductor to other circuits, is excellent in preventing crosstalk noise and shielding effect.

Process for producing coaxial conductor interconnection wiring board

A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.

Process for producing printed wiring board

A coaxial conductor interconnection wiring board includes at least one coaxial conductor and at least one conductive hole having an inner wall covered with a metal film connected to a central signal conductor of the coaxial conductor. The conductive shield of the coaxial conductor is connected to the ground layer by connection metal layers. A conductor insulating layer surrounds the metallized conductor hole and the connection metal layers surround a part of the additional conductor insulating layer. Thus, the conductive hole, insulating layer, and connection metal layers function as a coaxial conductor.

Coaxial conductor interconnection wiring board

An adhesive composition for producing printed wiring boards comprising (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating, and (E) a coupling agent having an ethylene or vinyl group, is useful in a so-called additive process.

Adhesive composition for printed wiring boards with

A high-density wired circuit board obtained by providing an auxiliary grid at the position of centroid of a main grid and by employing wiring in the inclined direction mainly instead of wiring in the XY directions mainly can make the space between wires and through-holes large without narrowing a wiring pitch.

High-density wired circuit board using insulated wires

A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20.ltoreq.(B)/(A)+(B).ltoreq.85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15.mu., in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.

Method of improving adhesion between insulating substrates and metal

Growing community of inventors

Shimodate, Japan

Yorio Iwasaki