Samsung Electronics Co., Ltd.

Yoonsung Kim

Hyunjung Lee

Sunae Kim

Yeongkwon Ko

Unbyoung Kang

Teakhoon Lee

Soyeon Kwon

A semiconductor package and a method of forming the same are provided. The semiconductor package includes: a semiconductor substrate having a front side and a back side, the semiconductor substrate having a chip area and a dummy area; a front structure below the front side, and including an internal circuit, an internal connection pattern, a guard pattern, and a front insulating structure; a rear protective layer overlapping the chip area and the dummy area, and a rear protrusion pattern on the rear protective layer and overlapping the dummy area, the rear protective layer and the rear protrusion pattern being on the back side; a through-electrode structure penetrating through the chip area and the rear protective layer, and electrically connected to the internal connection pattern; and a rear pad electrically connected to the through-electrode structure. The internal circuit and the internal connection pattern are below the chip area, and the guard pattern is below the chip area adjacent to the dummy area.

Semiconductor package and method of forming the same

Mobile phone displaying graphical user interface

Growing community of inventors

Seongnam-si, South Korea

Yoonsung Kim