Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Amotech Co., Ltd.

Yoonsun Park

Hongki Moon

Seunghoon Kang

Jaeyoung Huh

Boram Kim

Kyungha Koo

Jonghoon Lim

Kyungwoo Lee

Seungjoo Lee

Seyoung Jang

Ohhyuck Kwon

Daesuk Kang

Youngjin Kim

Kyungwan Park

Hajoong Yun

Hyun Sook Kim

Jinmyoung Kim

Hyunjoo Lee

Younho Choi

Sukjin Yun

Yeonjoo Lee

Byeonghoon Park

Yongjae Song

Jinhyoung Lee

Sunghoon Moon

Kyeongsoo Kim

Jiseong Hwang

Youngjae You

Woontahk Sung

Joseph Ahn

Seungbo Hong

Jaewook Jeong

Hyunjin Bai

Jungho Bae

Kihoon Jang

Jaecheon Kim

Seungjae Hwang

Woojune Jung

An electronic device includes a first housing; a second housing slidable into and out of the first housing; a sliding plate configured to be at least partially slid within the second housing; a flexible display including a display area that is variable as the second housing slides into and out of the first housing; a printed circuit board in an inner space of the first housing; a first shaft; and a thermal diffusion member including a first end, disposed on the at least one electronic component and partially wound, and a second end coupled to the first shaft, and the thermal diffusion member is configured such that at least a portion of the thermal diffusion member spreads out in an inner space of the second housing as a sliding-out operation is performed by the second housing with respect to the first housing.

Electronic device comprising thermal diffusion member

Disclosed is an electronic device including a housing including a first surface, a second surface facing away the first surface, and a third surface surrounding a space between the first surface and the second surface; a display exposed through the first surface; a battery disposed in the space; a heating source disposed between the battery and the third surface; and a thermal diffusion member disposed between the heating source and the battery. The thermal diffusion member includes a fluid; a first portion disposed adjacent to the heating source for receiving heat from the heating source; and at least one second portion extending from the first portion. The heat transferred from the heating source to the first portion is transferred from the first portion to the at least one second portion.

Electronic device having thermal diffusion structure

Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.

Electronic device including heat dissipation structure

An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.

Heat dissipation sheet and electronic device including same

An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

Electronic device including vapor chamber

Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.

An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.

Electronic device with heat-radiant structure

An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.

Camera module including heat dissipating structure and electronic device including the same

An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.

Heat transfer member and electronic device including the same

According to various embodiments, an electronic device includes: a housing including: a first plate; a second plate facing a direction opposite a direction of the first plate; and a sidewall surrounding a first space between the first plate and the second plate, the first space being a sealed space; and at least one electronic component arranged in the first space of the housing, wherein at least a part of the sidewall of the housing includes a moisture induction portion configured to induce moisture in the first space to be generated in a moisture induction region of the moisture induction portion that may be due, for example, to a difference in temperature between the first space and an external environment.

Electronic device including moisture induction structure

Growing community of inventors

Suwon-si, South Korea

Yoonsun Park