Samsung Electronics Co., Ltd.

Yoonna Oh

Yesin Ryu

Jaeho Lee

Kyungryun Kim

Hyunki Kim

Hohyun Shin

Jin Hwan Choi

Sanguhn Cha

Taewon Kim

Jae-pil Shin

Moon-Hyun Yoo

Jong-Bae Lee

Deok-Gu Yoon

A memory device includes a row decoder, a column decoder, and a repair control circuit, which is configured to: (i) compare a row address with a stored failed row address, (ii) compare a column address with a stored failed column address, (iii) control the row decoder to activate the at least one of a plurality of redundancy word lines when the row address corresponds to the failed row address, and (iv) control the column decoder to activate at least one of a plurality of redundancy bit lines when the column address corresponds to the failed column address. The repair control circuit varies a repair unit according to an address input during a repair operation.

Memory devices having variable repair units therein and methods of repairing same

A semiconductor memory device includes a memory cell array, a bit-line switch, a block switch, and a column decoder. The memory cell array includes memory blocks coupled to at least one word-line and each of the memory blocks includes memory cells. The bit-line switch is connected between a first half local input/output (I/O) line of a first memory block and a second half local I/O line of the first memory block. The block switch is connected between the second half local I/O line of the first memory block and a first half local I/O line of a second memory block adjacent to the first memory block. The column decoder includes a repair circuit that controls connections by applying a first switching control signal to the bit-line switch and a second switching control signal to the block switch.

Semiconductor memory device capable of increasing flexibility of a column repair operation

A semiconductor memory device comprises a memory cell array including segments disposed at corresponding intersections of row and column blocks, each row block including dynamic memory cells coupled to word-lines and bit-lines, a row decoder that activates a first word-line of a first row block in response to a row address, determines whether the first row block is a master block based on a first fuse information and a second row block is mapped as a slave to the master block, activates a second word-line of the second row block, and outputs a row block information signal, and a column decoder accessing a portion of first memory cells coupled to the first word-line or a portion of second memory cells coupled to the second word-line based on a column address, the row block information signal and a second fuse information.

Semiconductor memory devices and methods of operating semiconductor memory devices

A memory device includes a memory cell array and a column decoder. The memory cell array includes a plurality of mats connected to a word line. The column decoder includes a first repair circuit in which a first repair column address is stored, and a second repair circuit in which a second repair column address is stored. When the first repair column address coincides with a column address received in a read command or a write command, the column decoder selects other bit lines instead of bit lines corresponding to the received column address in one mat from among the plurality of mats. When the second repair column address coincides with the received column address, the column decoder selects other bit lines instead of the bit lines corresponding to the received column address in the plurality of mats.

Memory device including column redundancy

In a method of inspecting a mask, an image of a pattern on the mask may be obtained. A histogram of the image by grey levels may be obtained. The histogram may be compared with information of the pattern to detect a defect of the mask. Thus, reliability of defect detection in the mask may be remarkably improved.

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Seongnam-si, South Korea

Yoonna Oh