Semes Co., Ltd.

Yoonki Sa

Junho Kim

Pil Kyun Heo

Jaeseong Lee

Hyun Yoon

Yong-Jun Seo

Youngje Um

Man Kyu Kang

Doyeon Kim

Kyungsik Shin

Yerim Yeon

Jinki Shin

Dongok Ahn

Youngseo An

Jungsuk Goh

Choonghyun Lee

Byeong Geun Kim

The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

Method and apparatus for treating substrate

An apparatus for treating a substrate includes a process chamber having a process space therein, a support unit that supports the substrate in the process space, a heating member that heats the substrate supported on the support unit, and an exhaust unit that evacuates the process space. The exhaust unit includes an exhaust duct and a heat retention unit having a retention space that retains heat released from the process space. The retention space surrounds an adjacent area located adjacent to the process chamber in the exhaust duct.

Apparatus and method for treating substrate

Growing community of inventors

Seoul, South Korea

Yoonki Sa