Amkor Technology, Inc.

Hyundai Motor Company

Amkor Technology Singapore Holding Pte. Ltd.

YoonJoo Kim

Seungjae Lee

Sungkyu Kim

Jin Young Kim

Jong Sik Paek

Doo Hyun Park

Jin Han Kim

Se Woong Cha

Dong Jin Kim

Jae Hun Bae

Jinyoung Kim

Jongil Park

Hyuk Im

Donghee Han

Seungkook Han

DooHyun Park

Dongho Chu

Hongjip Kim

JongSik Paek

JinHan Kim

SeWoong Cha

JaeHun Bae

DongJin Kim

A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

A semiconductor device with a redistribution structure on partial encapsulation is disclosed and may include an electronic device having a top surface, a bottom surface, and side surfaces between the top and bottom surfaces of the electronic device. An encapsulant may encapsulate the side surfaces of the electronic device, a contact pad may be on the top surface of the electronic device, and a redistribution structure may be coupled to the contact pad. The redistribution structure may include a linear portion and a bump pad, and a conductive bump on the bump pad may include a main bump and a protruding part extending toward the linear portion, where the protruding part may be smaller than the main bump.

A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include a semiconductor die having a first surface, a second surface opposite to the first surface, and side surfaces between the first and second surfaces; an encapsulant encapsulating the side surfaces of the semiconductor die; a contact pad on the first surface of the semiconductor die; and a redistribution layer coupled to the contact pad The redistribution layer may include a linear portion and a circular pad, and a hemispherical conductive bump on the circular pad may include a protruding part extending toward the linear portion and having a radius less than the hemispherical conductive bump. The second surface of the semiconductor die may be coplanar with a surface of the encapsulant. A dielectric layer may cover a portion of the first surface of the semiconductor die and a first surface of the encapsulant.

An engine system may include an electric or mechanical supercharger and an LP-EGR, basically with a turbocharger, an EGR valve, a channel control valve, and a bypass valve, which control the flow rate of external air and exhaust gas, may be integrally operated, and a operation section may be divided into a turbo-lag and low torque section, a mid-load section, and mid/high-load section such that the open amount of EGR valve, channel control valve, and bypass valve may be optimally controlled, such that it may be possible to improve availability for a low-speed/high-load section with turbo-lag reduced, using supercharger and considerably increase the ratio of fuel efficiency improvement in the low-speed/high-load section, using LP-EGR operating with supercharger.

Engine system based on turbo charger and fuel ratio improving method thereof

Growing community of inventors

Seoul, South Korea

YoonJoo Kim