Samsung Electronics Co., Ltd.

Entegris, Inc.

Yoonhae Kim

Myungil Kang

Kwanheum Lee

Jongki Jung

Kyungin Choi

Dohyoung Kim

Hwichan Jun

Kwang-Yong Yang

Doo-Young Lee

Heungsik Park

Hwasung Rhee

Ah-Young Cheon

Jaeran Jang

Sooyeon Jeong

Chulsung Kim

Hyoseok Choi

Ping Hsun Su

Joon Goo Hong

Jin Wook Lee

Yongjin Kim

Deokhan Bae

Byeongchan Lee

Myeongcheol Kim

Junjie Xiong

Hong Seong Kang

SangJin Lee

Suehye Park

Yoonseok Lee

Youshin Choi

SeongCheol Kim

YeRim Yeon

KieJin Park

MinSeok Ryu

Some embodiments relate to a precursor comprising a precursor for vapor deposition. The precursor comprises an aliphatic hydrocarbon and at least one disilylamine group. The at least one disilylamine group is attached to the aliphatic hydrocarbon. The at least one disilylamine group does not comprise a silanide group. Some embodiments relate to a method for making the precursor. The method comprises reacting a polyamine compound and a silylhalide compound in a presence of a base to form a precursor useful for vapor deposition. Some embodiments relate to a method for forming a silicon-containing film using the precursor.

Precursors and related methods

A semiconductor device includes a substrate, a first active fin on the substrate, the first active fin including a first side surface and a second side surface opposing the first side surface, a second active fin on the substrate, the second active fin including a third side surface facing the second side surface and a fourth side surface opposing the third side surface of the second active fin, a first isolation layer on the first side surface of the first active fin, a second isolation layer between the second side surface of the first active fin and the third side surface of the second active fin, a third isolation layer on the fourth side surface of the second active fin and a merged source/drain on the first and second active fins.

Semiconductor device having asymmetrical source/drain

Provided is a semiconductor device including a substrate with an active pattern, a gate electrode crossing the active pattern, a source/drain region in an upper portion of the active pattern at a side of the gate electrode, the source/drain region including a recess region at an upper region thereof, a contact electrically connected to the source/drain region, the contact including a lower portion provided in the recess region, and a metal silicide layer provided at a lower region of the recess region and between the source/drain region and the contact.

Semiconductor device

A semiconductor device includes a substrate, an active fin protruding from the substrate, and an asymmetric diamond-shaped source/drain disposed on an upper surface of the active fin. The source/drain includes a first crystal growth portion and a second crystal growth portion sharing a plane with the first crystal growth portion and having a lower surface disposed at a lower level than a lower surface of the first crystal growth portion.

Semiconductor devices are providing including a first isolation region configured to define a first fin active region protruding from a substrate, first gate patterns on the first fin active region, and a first epitaxial region in the first fin active region between the first gate patterns. Sidewalls of the first epitaxial region have first inflection points so that an upper width of the first epitaxial region is greater than a lower width of the first epitaxial region.

Semiconductor devices having FIN active regions

Semiconductor device with field effect transistors and method of fabricating the same

Methods of fabricating a semiconductor device include forming a gate pattern on a substrate, forming spacers to cover both sidewalls of the gate pattern, forming an interlayer insulating layer to cover the gate pattern and the spacers, and forming contact holes to penetrate the interlayer insulating layer and expose sidewalls of the spacers. The forming of the spacers includes forming a spacer layer to cover the gate pattern and injecting silicon ions into the spacer layer. The spacer layer is a nitride-based low-k insulating layer, whose dielectric constant is lower than that of silicon oxide.

Methods of fabricating semiconductor devices

Semiconductor devices having fin active regions

A semiconductor device includes a substrate provided with active patterns, gate electrodes extending across the active patterns, source/drain regions provided in upper portions of the active patterns between the gate electrodes, respectively, and first contacts and second contacts provided between the gate electrodes and electrically connected to the source/drain regions, respectively. The first and second contacts are disposed in such a way that a contact center line thereof is spaced apart from a corresponding gate center line by first and second distances. The first distance differs from the second distance.

Semiconductor device and method of fabricating the same

A semiconductor device includes a first pattern on a first active region, a second pattern on a second active region, and a third pattern on a third active region. The first pattern is spaced from the second pattern by a first interval corresponding to the width of a first recess between the first and second active regions. The second pattern is spaced from the third pattern by a second interval corresponding to the width of a second recess between the second and third active regions. The first, second, and third patterns includes gate patterns, and the first and second recesses include semiconductor material with a conductivity type different from the active regions. The semiconductor material in one recess extends higher than the semiconductor material in the other recess. The first, second, and third patterns have the same width, and the first and second recesses have different depths.

A semiconductor device includes first and second active regions. Each active region includes a plurality of fin protrusions and a recessed area disposed between the fin protrusions. A plurality of gate structures are disposed on each of the plurality of fin protrusions. A semiconductor layer is disposed in each recessed area. A distance between the gate structures of the first active region is the same as a distance between the gate structures of the second active region, and a height difference between a bottom surface of the semiconductor layer of the first recessed area and a top surface of each of the fin protrusions of the first active region is smaller than a height difference between a bottom surface of the semiconductor layer of the recessed area of the second active region and a top surface of each of the fin protrusions of the second active region.

A semiconductor device includes a substrate having an active region and a device isolation layer defining the active region, a gate electrode on the active region, source/drain regions at the active region at both sides of the gate electrode, a buffer insulating layer on the device isolation layer, an etch stop layer formed on the buffer insulating layer and extending onto the gate electrode and the source/drain region, a first interlayer insulating layer on the etch stop layer, a first contact and a second contact penetrating the first interlayer insulating layer and the etch stop layer. The first contact and the second contact are spaced apart from each other and are in contact with the source/drain region and the buffer insulating layer, respectively.

Semiconductor device and method of forming the same

Growing community of inventors

Suwon-si, South Korea

Yoonhae Kim