Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Yoon Sung Na

Hun Joo Hahm

Young Sam Park

Seong Yeon Han

Kyung Taeg Han

Ho Sik Ahn

Chang Ho Song

In Tae Yeo

Dae Yeon Kim

Dae Cheon Kim

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Light emitting diode package and fabrication method thereof

Growing community of inventors

Gyunggi-do, South Korea

Yoon Sung Na