Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Yoon Suk Han

Young Jae Song

Chang Wook Kim

Jae Joon Yoon

Ok Hee Shin

Byung Man Kim

Young Taek Kim

Jae Ky Roh

Seong Jae Hong

A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Side view light emitting diode package

Light-emitting diode

Growing community of inventors

Seoul, South Korea

Yoon Suk Han