Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Hyundai Motor Company

Yoon Su Kim

Young Kyu Jin

Keum Koo Lee

Sung Woo Han

Seung Min Baek

Young Do Kweon

Young Hwan Shin

Tae Gon Lee

Kyoung Ro Yoon

Byung Lyul Park

Jin Gu Kim

Chang Bae Lee

Kyung Seob Oh

Hyung Jin Jeon

Jin Hyuck Yang

Kyoung Moo Harr

Seok Il Hong

Jung Joo Sohn

Ye Seul Hong

Nam Young Kim

Sahng Hee Bahn

Young Jae Lee

Kyung Ho Jeong

Kyung Suk Shim

Du Sung Jung

Jae Seok Myung

A cassette which receives a substrate, and a substrate receiving system including a chamber which receives a cassette in which a substrate is loaded are provided. The cassette which receives a substrate includes: a plurality of slot supports stacked in a first direction; and a frame connected to the plurality of slot supports and extending in the first direction, wherein the plurality of slot supports and the frame are opened in an outward direction to receive the substrate, and are closed in an inward direction after the substrate is received.

Open-ended type substrate receiving cassette and system thereof

A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.

Semiconductor package

According to an embodiment, a smart control device includes an input device; a communication circuit; a connection circuit configured to be electrically connected to another control device; a processor; and a memory. Wherein the memory stores one or more instructions that, when executed, cause the processor to when the control device is not connected with the another control device through the connection circuit, transmit a message associated with a request for execution of a first function to the external device through the communication circuit when receiving an input signal based on the input device; and in when control device is connected with the another control device through the connection circuit, transmit a message associated with a request for execution of a second function corresponding to the second state to the external device through the communication circuit when receiving a user input associated with execution of a specified function.

Control device and method for controlling function thereof

Display screen or portion thereof with graphical user interface

A printed circuit board includes an insulating layer; and a circuit pattern formed on the insulating layer. The circuit pattern includes a seed layer and a metal layer formed on the seed layer, and both sides of the seed layer are formed with an etched groove. Also, a method of manufacturing a printed circuit board includes: forming a seed layer on the insulating layer; forming a plating resist formed with an opening on the seed layer; forming a circuit pattern by performing plating processing on the opening; removing the plating resist; forming a passivation layer on the circuit pattern; performing dry etching on a remaining portion other than a side wall of the passivation layer; and performing wet etching the seed layer exposed on a surface by the dry etching.

Line width protector printed circuit board and method of manufacturing the same

The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Electrode structure

The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material.

Circuit board and method for manufacturing the same

A system and a method for controlling an electrically-powered steering apparatus of a vehicle may include a selection switch adapted to select any of a plurality of steering modes, a control switch adapted to change a current for controlling the steering force, a control portion adapted to determine the current according to a signal received from at least one of the selection switch and the control switch and to transmit a control signal according to the determined current, and a drive portion adapted to control the steering force according to the control signal received from the control portion.

System and method for controlling electrically-powered steering apparatus of vehicle

Disclosed herein is a method for removing a seed layer in manufacturing a printed circuit board, the method including: forming a photo resist layer on a printed circuit board having a seed layer formed on a surface thereof; removing the photo resist layer according to a predetermined pattern; forming a plating layer for a circuit on the predetermined pattern from which the photo resist layer is removed; exposing the seed layer by removing the photo resist layer around the plating layer; forming a corrosion layer on surfaces of the seed layer and the plating layer by performing a chemical reaction of the substrate from which the seed layer is exposed in a reactor in which a predetermined gas is filled; and removing the seed layer by irradiating a laser on the corrosion layer to remove the corrosion layer.

Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same

A method for fabricating a semiconductor package substrate, including: preparing a copper clad laminate and half etching a copper foil on a wire bonding pad side of the copper clad laminate; depositing a first etching resist on the opposite sides of the copper clad laminate; forming circuit patterns on the first etching resist, constructing circuits including a wire bonding pad and a ball pad after the model of the circuit patterns, and removing the first etching resist; applying a solder resist to the copper clad laminate in such a way to expose the wire bonding pad and the ball pad; and plating the wire bonding pad with gold and subjecting the ball pad to surface treatment.

Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad

Disclosed herein are a semiconductor package substrate and a method for fabricating the same. In the semiconductor package substrate, the circuit layer of the wire bonding pad side differs in thickness from that of the ball pad side to which a half etching process is applied. In addition, a connection through hole is constructed to provide an electrical connection between the plating lead lines on the wire bonding pad side and the ball pad side, thereby preventing electrical disconnection when the plating lead line of the wire bonding pad side is cut.

Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same

Growing community of inventors

Suwon, South Korea

Yoon Su Kim