Samsung Electro-mechanics Co., Ltd.

Yoon Sok Park

Won Kyu Jeung

Jung Woo Sung

Sung Tae Kim

Tae Yoon Kim

Tah Joon Park

Tae Kyung Lee

Moon Chul Lee

Hyun Jun Kim

Hwa Sun Lee

Dae Hun Jeong

Chang Hyun Kim

Jun Young Kim

Ju Hwan Yang

Jong Woon Kim

Chang Hyun Lim

Sang Uk Son

Sung Woo Han

June Hyung Lee

Seung Joo Shin

Jae Woo Joung

Pil Joong Kang

Nam Jung Lee

Dong Hoe Kim

Jae Chan Park

Sung-Tae Kim

An acoustic resonator filter is provided. The acoustic resonator filter includes a rear filter electrically connected between a front port and a rear port, through which a radio frequency (RF) signal passes, the rear filter including at least one film bulk acoustic resonator (FBAR); and a front filter electrically connected between the front port and the rear filter and including at least one solidly mounted resonator (SMR).

Acoustic resonator filter

An acoustic resonator includes: an upper electrode including a first active region disposed on an upper portion of a piezoelectric layer, and a first extended region extended from the first active region; a lower electrode including a second active region disposed on a lower portion of the piezoelectric layer, and a second extended region extended from the second active region; a first metal layer including a first resistance reduction region disposed on the first extended region; and a second metal layer including a second resistance reduction region disposed on the second extended region. The first metal layer includes a first conductive link region extended from the first resistance reduction region. The second metal layer includes a second conductive link region extended from the second resistance reduction region. The first and second conductive link regions correspond to respective portions of a side boundary of the first and second active regions.

Acoustic resonator and acoustic resonator filter

A bulk-acoustic wave resonator includes: a first substrate formed of a first material; an insulating layer or a piezoelectric layer disposed on a first side of the first substrate; and a second substrate formed of a second material and disposed on a second side of the first substrate, wherein the second material has thermal conductivity that is higher than a thermal conductivity of the first material.

Bulk-acoustic wave resonator

A filter comprises a series unit comprising a plurality of series resonators, a shunt unit comprising a plurality of shunt resonators, connected between the plurality of series resonators and a ground, and a correction unit comprising an inductor unit connected between both ends of at least one of a set of series resonators of the plurality of series resonators and a set of shunt resonators of the plurality of shunt resonators, and an impedance unit connected between the inductor unit and a ground.

Filter with antiresonance frequency correction

A bulk acoustic wave resonator includes: support members disposed between air cavities; a resonant part including a first electrode, a piezoelectric layer, and a second electrode sequentially disposed above the air cavities and on the support members; and a wiring electrode connected either one or both of the first electrode and the second electrode, and disposed above one of the air cavities, wherein a width of an upper surface of the support members is greater than a width of a lower surface of the support members, and side surfaces of the support members connecting the upper surface and the lower surface to each other are inclined.

Bulk acoustic wave resonator

A filter includes a plurality of series portions each including one or more series resonators, and a plurality of shunt portions each including one or more shunt resonators. At least one of the plurality of shunt portions includes two shunt resonators connected to each other in anti-series, and antiresonance frequencies of the two shunt resonators are arranged externally of a passband.

Filter including bulk-acoustic wave resonator

A filter includes: a series part disposed between a signal input terminal and a signal output terminal, and including at least one first bulk-acoustic resonator; an inductor portion including a first inductor disposed between ends of the series part and a second inductor having a first end connected to a connection node of the series part and the first inductor; and a shunt part disposed between a second end of the second inductor and a ground, and including at least one second bulk-acoustic resonator, wherein a resonant frequency of the at least one second bulk-acoustic resonator is higher than a resonant frequency of the at least one first bulk-acoustic resonator.

Filter

An acoustic wave filter device includes resonance portions, first and second metal pads. The resonance portions each includes a lower electrode disposed on a substrate, a piezoelectric layer disposed on at least a portion of the lower electrode, and an upper electrode disposed on at least a portion of the piezoelectric layer. The first metal pads are connected to one of the upper electrode and the lower electrode of a corresponding resonance portion among the resonance portions. The second metal pads are disposed outwardly of an active region and connected to the other one of the upper electrode and the lower electrode of adjacent resonant portions among the resonance portions. A ring portion is disposed outwardly of the active region in which the lower electrode, the piezoelectric layer, and the upper electrode overlap is disposed only on a portion of any one of the first and second metal pads.

Acoustic wave filter device

A filter includes a multilayer structure having films configured as bulk acoustic wave resonators; a wiring line connected to the bulk acoustic wave resonators; a cap coupled to the multilayer structure on a bonding line; and the filtering characteristics of the filter being configured through a mutual inductance between the wiring line and the bonding line.

Filter including bulk acoustic wave resonator

A bulk acoustic wave resonator includes a substrate including a cavity groove, a membrane layer disposed above the substrate and including a convex portion. And a lower electrode including a portion thereof disposed on the convex portion. The bulk acoustic wave resonator also includes a piezoelectric layer configured so that a portion of the piezoelectric layer is disposed above the convex portion, and an upper electrode disposed on the piezoelectric layer. A first space formed by the cavity groove and a second space formed by the convex portion form a cavity, the cavity groove is disposed below an active region, and the convex portion comprises an inclined surface disposed outside of the cavity groove.

Bulk acoustic wave resonator and method of manufacturing the same

A filter includes a multilayer structure comprising films and forming bulk acoustic wave resonators, a cap accommodating the bulk acoustic wave resonators and bonded to the multilayer structure, a bonding agent disposed in a bonded area between the multilayer structure and the cap and comprising a bonding layer, and a shielding layer disposed on an inner surface of the cap and comprising a same material as at least a portion of the bonding layer.

A filter includes: series resonators connected to each other in series; shunt resonators connected to first nodes between some of the series resonators; and a variable capacitor connected to a second node between some of the series resonators, and forming a pole configured to suppress harmonics.

Filter and filter module

There is provided an inkjet print head including: an ink discharging unit including a plurality of actuators; a connection substrate disposed on the ink discharging unit and having a first circuit pattern electrically connected to the plurality of actuators; and a switching board having a second circuit pattern connected to the first circuit pattern and including a plurality of driving integrated chips (ICs) controlling the plurality of actuators.

Inkjet print head

There is provided an inkjet head and an inkjet head assembly having the same. The inkjet head includes an inkjet head plate having a plurality of nozzles ejecting ink provided therein; pressure chambers storing ink drawn in from both outer ends of the inkjet head plate in a width direction thereof and facing each other in a direction inwards of the width direction; piezoelectric elements supplying the pressure champers with driving force allowing ink to be ejected through the nozzles connected to the pressure chambers and disposed on the pressure chambers having membranes interposed therebetween; a pressure adjusting channel connecting the pressure chambers to adjust a pressure of ink ejected through the nozzles.

Growing community of inventors

Suwon-si, South Korea

Yoon Sok Park