Samsung Electronics Co., Ltd.

Yoon-Moon Park

Su-Jin Ahn

Choong-Ho Lee

Won-Cheol Jeong

Dong-Hoon Jang

Keon-Soo Kim

Jin-Ho Kim

Jae-Hwang Sim

Sang-Yong Park

Hee-Soo Kang

Kang-Ill Seo

Young-Ho Lee

Jae-Kwan Park

Jung-dal Choi

Jong-hyuk Kim

Min-Sung Song

Suk-Kang Sung

Jin-hyun Shin

Kwan-Young Chun

Dong-Kwon Kim

Dong-hwa Kwak

Se-Jun Park

Jang-ho Park

Deok-han Bae

Young-bae Yoon

Seung-Wook Choi

Jue-Hwang Sim

Wouns Yang

A semiconductor device includes a first active area, a second active area and a first gate line. The second active area is spaced apart from the first active area. The first gate line includes a first gate part crossing the first active area along a first imaginary line, a second gate part crossing the second active area along a second imaginary line, and a third gate part connecting the first gate part and the second gate part and extending along a third imaginary line crossing the first imaginary line and the second imaginary line. The first gate part, the second gate part and the third gate part are arranged so that the first gate line has a shape of 180&#xb0; rotational symmetry. A point of the rotational symmetry is located on the first gate part.

Semiconductor device and method of fabricating the same

A semiconductor device includes a first dummy gate having a first width, a second dummy gate adjacent to the first dummy gate in a lengthwise direction and having a second width, and a first bridge connecting the first dummy gate and the second dummy gate to each other. The first width and the second width are smaller than a minimum processing line width.

Semiconductor device and fabricating method thereof

A non-volatile memory device can include a plurality of parallel active regions that are defined by a plurality of device isolation layers formed on a semiconductor substrate, where each of the plurality of parallel active regions extends in a first direction and has a top surface and sidewalls. A plurality of parallel word lines can extend in a second direction and cross over the plurality of parallel active regions at intersecting locations. A plurality of charge storage layers can be disposed at the intersecting locations between the plurality of parallel active regions and the plurality of parallel word lines. Each of the plurality of charge storage layers at the intersecting locations can have a first side and a second side that is parallel to the second direction and can have a first length, a third side and a fourth side that are parallel to the first direction and can have a second length, where the first length is less than the second length.

Non-volatile memory devices having charge storage layers at intersecting locations of word lines and active regions

A flash memory device, including a cell array region where a plurality of memory cells are connected in series to a single cell string, the cell array region including a pocket p-well configured to accommodate the plurality of memory cells and an n-well configured to surround the pocket p-well, a first peripheral region where low-voltage (LV) and high-voltage (HV) switches are connected to the memory cells through a word line, and a second peripheral region where bulk voltage switches are connected to bulk regions of the LV and HV switches.

Flash memory device having triple well structure

Provided is a nonvolatile memory device having a common bit line structure. The nonvolatile memory device includes multiple unit elements having a NAND cell array structure, arranged in each of multiple memory strings, and each including a control gate and a charge storage layer. Multiple common bit lines are each commonly connected to ends of each of one pair of memory strings among the memory strings. Provided are a first selection transistor having a first driving voltage and multiple second selection transistors connected in series to the first selection transistors and having a second driving voltage that is lower than the first driving voltage. The first selection transistor and the second selection transistors are arranged between the common bit lines and the unit elements of the of memory strings.

Nonvolatile memory devices having common bit line structure

A method of fabricating a semiconductor device facilitates the forming of a conductive pattern of features having different widths. A conductive layer is formed on a substrate, and a mask layer is formed on the conductive layer. First spaced apart patterns are formed on the mask layer and a second pattern including first and second parallel portion is formed beside the first patterns on the mask layer. First auxiliary masks are formed over ends of the first patterns, respectively, and a second auxiliary mask is formed over the second pattern as spanning the first and second portions of the second pattern. The mask layer is then etched to form first mask patterns below the first patterns and a second mask pattern below the second pattern. The first and second patterns and the first and second auxiliary masks are removed. The conductive layer is then etched using the first and second mask patterns as an etch mask.

Method of fabricating semiconductor device

Nonvolatile memory devices are provided. Devices include active regions that may be defined by device isolation layers formed on a semiconductor substrate and extend in a first direction. Devices may also include word lines that may cross over the active regions and extend in a second direction intersecting the first direction. The active regions have a first pitch and the word lines have a second pitch that is greater than the first pitch.

Non-volatile memory devices having improved operational characteristics

Patterns are formed in a semiconductor device by defining a lower layer that includes a first region and a second region on a semiconductor substrate, forming first patterns with a first pitch that extend to the first and second regions, forming second patterns with a second pitch in the second region that are alternately arranged with the first patterns, forming a space insulating layer that covers the first and second patterns and comprises gap regions that are alternately arranged with the first patterns so as to correspond with the second patterns, forming third patterns that correspond to the second patterns in the gap regions, respectively, etching the space insulating layer between the first and second patterns and between the first and third patterns, such that the space insulating layer remains between the second patterns and the third patterns, and etching the lower layer using the first, second, and third patterns and the remaining space insulating layer between the second and third patterns as an etching mask.

Methods of forming a semiconductor device that allow patterns in different regions that have different pitches to be connected

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Seoul, South Korea

Yoon-Moon Park