Cheil Industries Inc.

Yoon Kok Park

Eun Jung Lee

Young Kyun Lee

Whan G Kim

Kun Bae Noh

Jo Gyun Kim

Suk Ku Chang

An epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition including an epoxy resin, a curing agent, and one or more inorganic fillers, the one or more inorganic fillers including prismatic cristobalite, the prismatic cristobalite being present in the epoxy resin composition in an amount of about 1 to about 50% by weight, based on the total weight of the epoxy resin composition.

Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same

An epoxy resin composition, and a method of making the same, includes an epoxy resin and a curing agent, the epoxy resin composition also includes inorganic fillers, curing accelerators, and modified silicone oils. The epoxy resin is a modified epoxy resin prepared by glycidyl etherification of a mixture of a novolac type phenolic compound having a biphenyl derivative in the molecule and a 4,4'-dihydroxy biphenyl compound, and the curing agent is a mixture of a polyaromatic curing agent and a polyfunctional curing agent.

Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same

An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of Rthrough R, independently, represents a hydrogen atom or a C-Chydrocarbon group, provided that when Rthrough Rare C-Chydrocarbon groups, Rand R, Rand R, Rand R, Rand R, Rand R, and Rand Rcan be joined to each other to form a cyclic structure.

Growing community of inventors

Suwon-si, South Korea

Yoon Kok Park