Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Samsung Electronics Co., Ltd.

Other

Korea Institute of Science and Technology

Yoon Joo Kim

Jin Young Kim

Sung Kyu Kim

Se Woong Cha

No Sun Park

Seung Jae Lee

Ju Hoon Yoon

Bong Chan Kim

Ji Young Chung

Jin Han Kim

Youn Sang Kim

Do Hyung Kim

Glenn A Rinne

Choon Heung Lee

Jin Ho Lim

Jae Kyu Song

Byung Hyun Ahn

In Tae Kim

In Su Yu

Jae Eun Yang

Il Hoe Jung

Do Hyeong Kim

Sung Chul Ha

Sung Min Lee

Byung Po Choi

Jong Sik Paek

Doo Hyun Park

Seong Min Seo

Kwang Ho Kim

Dong Jin Kim

Dong Hyun Yeom

Jae Yun Kim

Young Suk Chung

Do Hyun Na

Jung Eun Lee

Jae Hun Bae

Won Myoung Ki

Seok Ho Na

Jae Hak Jeon

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Electronic device package and fabricating method thereof

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 &#x3bc;m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

An electronic device is provided. The electronic device includes a communication module comprising communication circuitry, a memory configured to store first information indicating first image data generated using a first rendering scheme based on a first polyhedron configured with a first number of surfaces and second information indicating second image data generated using a second rendering scheme based on a second polyhedron configured with a second number of surfaces, and a processor. The processor is configured to verify state information of the electronic device, to select one of the first information and the second information based on the at least state information, to transmit a request corresponding to the selected information to an external electronic device via the communication module, to receive image data corresponding to the selected information between the first image data and the second image data from the external electronic device in response to the request, and to control playback of the received image data.

Electronic device for providing VR image based on polyhedron and image providing method thereof

An electronic device according to one embodiment of the present disclosure includes a display, an eye-tracking unit, and a processor. The processor determines a user's region of interest of an image, collects context information of the electronic device, determines first attribute information relating to image processing for the region of interest of the image and second attribute information relating to image processing for the remaining region other than the region of interest of the image, based at least on the context information, and displays, on the display, a first partial image obtained by the image processing for the region of interest using the first attribute information and a second partial image obtained by the image processing for the remaining region using the second attribute information.

Method for outputting image and electronic device supporting the same

A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material.

Semiconductor package and manufacturing method thereof

In one embodiment, an electronic device package structure includes an electronic die having conductive pads on one surface. The one surface is further attached to at least one lead. A conductive layer covers at least one conductive pad and at least portion of the lead thereby electrically connecting the lead to the conductive pad.

Electronic device package structure and method of fabricating the same

Package of finger print sensor and fabricating method thereof

In one embodiment, a semiconductor package includes a first semiconductor die having a first surface facing upwardly to expose a bond pad, a second semiconductor die having a first surface facing downwardly to expose a bond pad and disposed to be offset with the first surface of the first semiconductor die, and an encapsulant encapsulating the first semiconductor die and the second semiconductor die together. Throughholes are disposed in the encapsulant adjacent the bond pad of the first semiconductor die and adjacent the bond pad of the second semiconductor die.

Semiconductor device

A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling.

Wafer level fan-out package with a fiducial die

Growing community of inventors

Nowon-gu, Seoul, South Korea

Yoon Joo Kim