Semes Co., Ltd.

Yoon Jong Ju

Wan Jae Park

Min Sung Han

Kihoon Choi

Ji Hoon Park

Jinkyu Kim

Seong Gil Lee

Do Yeon Kim

Young Je Um

Joon Ho Won

Kwangsup Kim

Hyeon Jun Lee

Yong Tak Hyun

Doyeon Kim

Hye Joon Kheel

Ji-hwan Lee

Jae Hwan Kim

Jae Hoo Lee

Keunhwa Yang

Seong Hak Bae

Jaehoo Lee

Kyung Man Kim

Jeong Woo Han

The present invention provides a support unit, including: a support plate on which a substrate is placed, and which includes an electrostatic electrode providing electrostatic force to the substrate; a heater provided inside the support plate and configured to heat the substrate; an insulating plate provided under the support plate as an insulating substance; and a bimetal member disposed inside the support plate and configured to compensate for bending of the support plate due to heat, in which the bimetal member includes: a pin provided to be in contactable with a bottom surface of the substrate that is placed on the support plate; a first member configured to support the pin; and a second member provided to surround the first member, and the pin is provided to move up or move down according to a difference in the amount of thermal deformation between the first member and the second member.

Support unit and substrate treating apparatus

The present invention provides a substrate treating method, including: a first treatment operation of treating the substrate by using first plasma generated by exciting first gas; and a second treatment operation of treating the substrate by using second plasma generated by exciting second gas different from the first gas.

Substrate treating apparatus and substrate treating method

Provided are a substrate processing apparatus and method for increasing the uniformity of substrate processing. The substrate processing apparatus comprises a first space disposed between an electrode and an ion blocker, a second space disposed between the ion blocker and a shower head, and a processing space for processing a substrate under the shower head, wherein the ion blocker includes a first region and a second region that are separated from each other, and includes a plurality of first supply ports for supplying a first reaction gas to the second space, wherein the plurality of first supply ports are formed in the first region and not formed in the second region, wherein the shower head includes a third region corresponding to the first region, a fourth region corresponding to the second region, and a plurality of second supply ports for supplying a second reaction gas to the second space, wherein the plurality of second supply ports are not formed in the third region, and are formed in the fourth region.

Apparatus and method for processing substrate using plasma

The present invention relates to a substrate processing apparatus capable of shortening a process time, and the substrate processing apparatus according to the present invention comprises an index chamber having a transfer robot loading/unloading a substrate; a process chamber having a heating means heating the substrate and processing the substrate; a loadlock chamber disposed between the index chamber and the process chamber; and a conveying chamber having a conveying robot conveying the substrate between the process chamber and the loadlock chamber, wherein a pre-heating means is provided in the conveying robot to pre-heat the substrate in a state before processing.

Substrate processing apparatus

An apparatus for processing a substrate comprises a processing vessel having a processing space inside, a substrate support unit that supports and rotates the substrate in the processing vessel, and a nozzle unit that dispenses a processing liquid onto the substrate. The nozzle unit comprises a nozzle that dispenses the processing liquid and an ultraviolet (UV) light supply unit that emits UV light to activate radicals of the processing liquid dispensed onto the substrate.

Substrate processing apparatus and nozzle unit

The present disclosure relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus according to the exemplary embodiment of the present disclosure may include: a processing liquid supply tube; a nozzle unit which is supplied with a processing liquid from the processing liquid supply tube and discharges the processing liquid to the substrate; and a light source unit which is provided to irradiate the processing liquid discharged from the nozzle unit with ultraviolet rays. According to the present disclosure, the processing liquid, which is electrified while passing the processing liquid supply tube, is irradiated with ultraviolet rays, such that electricity is eliminated from the electrified processing liquid, and as a result, it is possible to minimize a problem that the substrate is contaminated by peripheral particles or arcing occurs on the substrate.

Substrate processing apparatus and substrate processing method

A substrate treating apparatus includes a treatment unit including a container, and a support member in the interior of the container to support a substrate, the treatment unit being configured to treat the substrate a nozzle unit having a treatment liquid nozzle for supplying a treatment liquid to the substrate provided in the treatment unit and an inspection unit that inspects whether the treatment liquid is normally discharged from the treatment liquid nozzle. The nozzle further includes a nozzle driver that moves the treatment liquid nozzle from a process position at which the substrate is treated by the treatment unit and an inspection position at which the treatment liquid nozzle is inspected by the inspection unit.

Inspection unit, inspection method, and substrate treating apparatus including the same

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing having a space for treating a substrate in the interior thereof, a spin head which supports and rotates the substrate inside the housing, and an ejection unit having a first nozzle member for ejecting a first treatment liquid onto the substrate positioned on the spin head. The first nozzle member includes a body having an ejection passage, through which the first treatment liquid flows, therein and a first discharge hole communicated with the ejection passage to eject the first treatment liquid onto the substrate, and a vibrator installed in the body to provide vibration for the first treatment liquid flowing through the ejection passage. The vibrator has an interference preventing recess for preventing an interference by reflective waves therein.

Substrate treating apparatus and treatment liquid nozzle

Growing community of inventors

Cheonan-si, South Korea

Yoon Jong Ju