Luxrobo

Samsung Electronics Co., Ltd.

Other

Luxrubo

Yoon Hwan Son

Sang Hun Oh

Seok Jung Kim

Jeong In Kim

Ji Sung Cheon

Seok Cheon Baek

Sung Won Cho

Joo Hee Park

Ga Eun Kim

A semiconductor memory device and a method for fabricating a semiconductor memory device, the device including a peripheral logic structure on a substrate; a horizontal conductive substrate on the peripheral logic structure; a stacked structure including a plurality of electrode pads stacked in a vertical direction; a plate contact plug connected to the horizontal conductive substrate; and a first penetration electrode connected to the lower connection wiring body, wherein upper surfaces of the plate contact plug and the first penetration electrode are on a same plane, the plate contact plug includes an upper part and a lower part directly connected to each other, the first penetration electrode includes an upper part and a lower part directly connected to each other, moving away from upper surfaces of the first penetration electrode and the plate contact plug, widths of the upper parts increase and widths of the lower parts decrease.

Semiconductor memory device and method of fabricating the same

A semiconductor device includes a first substrate in which a first region and a second region are defined, a first stack structure with first gate electrodes displaced and stacked sequentially on the first substrate, a second stack structure with second gate electrodes displaced and stacked sequentially on the first stack structure, a junction layer disposed between the first stack structure and the second stack structure, a first interlayer insulating layer disposed on a side surface of the first stack structure, a second interlayer insulating layer covering the second stack structure, a first channel hole that penetrates through structure(s) and/or layer(s) and a second channel hole that penetrates through structure(s) and/or layer(s). A height of the second portion of the first channel hole in a second direction orthogonal to the first direction is less than a height of the second portion of the second channel hole in the second direction.

Semiconductor device

A semiconductor device may include a substrate and a stacked structure in which a plurality of insulating layers and a plurality of interconnection layers are alternately stacked on the substrate. An isolation region may cross the stacked structure in a first direction. A plurality of first structures may extend into the stacked structure in a second direction perpendicular to the first direction. A plurality of first patterns may extend into the stacked structure in the second direction in the isolation region. Bottoms of the plurality of first patterns may be farther from an upper surface of the substrate than bottoms of the plurality of channel structures.

Semiconductor devices including channel structures

Lamp module for electronic device

Communication module for electronic device

Push button module for electronic device

Provided are a module assembly, a connector, and an electronic device, the module assembly including a first module that includes a pin configured to selectively protrude from a side thereof, a pin installation portion in which the pin is installed to be movable, and a first magnet configured to attract the pin into the pin installation portion, a second module to be coupled to the first module, the second module including a pin receiver configured to receive the pin when the pin protrudes from the first module, and a second magnet configured to attract the pin into the pin receiver, wherein the second magnet is configured to apply, to the pin, a greater magnitude of magnetic force than the first magnet in a case in which a distance between the first module and the second module is less than a preset distance.

Module assembly and connector and electronic device

Provided is a module assembly including a plurality of modules. The modules each include a polyhedral housing with a polygonal plane, a pin provided on one side of a corner of the housing to selectively protrude, a pin installation portion in which the pin is installed to be movable, a pin receiver provided on another side of the corner of the housing such that a pin of another module is to be inserted thereinto, and a magnet installed between the pin installation portion and the pin receiver, and configured to apply magnetic force to both the pin provided in the pin installation portion and the pin of the other module to be received in the pin receiver.

Module assembly

Growing community of inventors

Seoul, South Korea

Yoon Hwan Son