Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Yoon Hee Lee

Jong Han Kim

Jung Min Kim

Bon Seok Koo

Seung Ho Lee

Min Gon Lee

Jung Wook Seo

Kun Hoi Koo

Chang Hak Choi

Jae Man Park

Ro Woon Lee

Ye Jun Park

Young Ho Kim

Yeon Tae Kim

Sung Hwan Lee

Dong Hoon Kim

Yeon Ho Kim

Jin Woo Lee

Jae Ho Kim

Eun Young Jung

Sung Koo Kang

Jang Ho Lee

Won Young Chi

Sung Hyun Ryu

Chi Hyoun Ro

Sook Hyun Kong

Kyung Jin Choi

A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.

Coil component and method of manufacturing the same

A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.

Multilayer capacitor having external electrode including conductive resin layer

A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.

A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.

There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers; and a plurality of internal electrodes disposed within the ceramic body, having the dielectric layer interposed therebetween, wherein, on a cross section of the ceramic body in a width-thickness direction thereof, when a distance between an uppermost internal electrode and a lowermost internal electrode measured at centers thereof in a width direction thereof is defined as a and a distance between the uppermost internal electrode and the lowermost internal electrode measured at edges thereof in the width direction thereof is defined as b, 0.953&#x2266;a/b&#x2266;0.996 is satisfied.

Multilayer ceramic capacitor, method of manufacturing the same, and board having the same mounted thereon

There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes disposed to face each other within the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the ceramic body includes a capacitance forming part contributing to capacitance formation and a non-capacitance forming part provided on at least one of upper and lower surfaces of the capacitance forming part, and when the capacitance forming part is divided into three areas in a thickness direction of the ceramic body, a difference in continuity between internal electrodes in a middle area of the three areas and internal electrodes in upper and lower areas thereof is 1% to 5%.

Multilayer ceramic electronic component having controlled difference in continuity between internal electrodes and method of manufacturing the same

There is provided a multilayer ceramic electronic component including: a ceramic body including dielectric layers; and a plurality of internal electrodes disposed in the ceramic body, having at least one of the dielectric layers interposed therebetween, wherein when a distance between a widthwise end of an internal electrode disposed at a central portion of the ceramic body in a thickness direction thereof and an adjacent side surface of the ceramic body is defined as D1 and a distance between a widthwise end of an internal electrode disposed at an upper or lower portion of the ceramic body in the thickness direction thereof and the adjacent side surface of the ceramic body is defined as D2, D1/D2 is in a range of 0.5 to 0.95 (0.5&#x2266;D1/D2&#x2266;0.95).

Multilayer ceramic electronic component and board having the same mounted thereon

There is provided a multilayer ceramic electronic component including a ceramic body including dielectric layers, internal electrodes formed in the ceramic body and including pores, and first and second external electrodes formed on both end portions of the ceramic body, wherein in a cross section of the ceramic body in length and thickness directions, when a thickness of the internal electrode is to and a thickness of the pore is tp, 0.41&#x2266;tp/te&#x2266;0.86 is satisfied.

Multilayer ceramic electronic component and method of manufacturing the same

There is provided a multilayer ceramic electronic component including a ceramic body including a plurality dielectric layers stacked thereon, a plurality of internal electrodes formed to be exposed to both end surface of the ceramic body, having the dielectric layer interposed therebetween, and external electrodes formed on the end surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein connectivity of the internal electrode is equal to or greater than 87%.

There is provided a multilayer ceramic electronic component, including a ceramic body, and an internal electrode formed in the ceramic body and having a plurality of non-electrode regions formed therein, wherein in a cross section formed in length and thickness directions of the ceramic body, when a thickness of the internal electrode is Te, an area of the internal electrode is Ae, and an area of the plurality of non-electrode regions is Ao, 0.1 &#x3bc;m&#x2266;Te&#x2266;0.55 &#x3bc;m and 3.2%&#x2266;Ao:Ae&#x2266;4.5% are satisfied.

Multilayer ceramic electronic component having internal electrode with non-electrode regions and method of manufacturing the same

There is provided a multilayer ceramic electronic component including a ceramic body including dielectric layers, and first and second internal electrodes formed within the ceramic body and disposed to face each other having the respective dielectric layers interposed therebetween, wherein in a cross-section of the ceramic body in a length-thickness (L-T) direction, when an area of non-electrode regions in cover part internal electrodes among the first and second internal electrodes is defined as Aand an area of non-electrode regions in center part internal electrodes among the first and second internal electrodes is defined as A, a ratio of Ato Asatisfies 0.33&#x2266;A/A&#x2266;0.95.

Multilayer ceramic electronic component and mounting board therefor

There is provided a multilayer ceramic electronic component, including: a ceramic body; and internal electrodes formed inside the ceramic body and having a plurality of non-electrode regions, wherein, on a cross-section taken in length and thickness directions of the ceramic body, when a thickness of the internal electrode is denoted by Te, a continuity of the internal electrode is denoted by C, an area of the internal electrode is denoted by Ae, an area of the plurality of non-electrode regions is denoted by Ao, and a maximum diameter of the non-electrode region having the maximum diameter among the plurality of non-electrode regions is denoted by Pmax, 0.1 &#x3bc;m&#x2266;Te&#x2266;0.5 &#x3bc;m, 1.1%&#x2266;Ao/Ae&#x2266;3.2%, Pmax&#x2266;120 nm, and 95%&#x2266;C&#x2266;99.5% are satisfied.

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Gyunggi-do, South Korea

Yoon Hee Lee