Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Korea University Research and Business Foundation

Korea University Industrial Academic Collaboration Foundation

Yoon-chul Son

Dong-earn Kim

In-Taek Han

Min-jong Bae

Sung-hoon Park

Dong-ouk Kim

Kun-mo Chu

Ho-suk Kang

Yong-Chul Kim

Jeong-na Heo

Sang-Eui Lee

Ha-Jin Kim

Jeong-hee Lee

Ha-jin Kim

Byeong-kwon Ju

Sang-eui Lee

Young-Ho Kim

Woon-bae Kim

Chang-youl Moon

Kyu-Dong Jung

Jong-oh Kwon

Won-kyoung Choi

Kun Mo Chu

Woo-Sung Cho

Ha Jin Kim

Dong-Ouk Kim

Hee-ra Roh

Chang-yul Oh

A composite anode active material, a method of preparing the composite anode active material, and a lithium battery including the lithium battery. According to the method of preparing the composite anode active material, carbon nanotubes are formed on a Si particle without a separate operation of applying a catalyst. Furthermore, high adherence is provided between the Si particle and carbon nanotubes, and therefore the composite anode active material is used as an anode material of the lithium battery.

Composite anode active material, method of preparing the composite anode active material, and lithium battery including the composite anode active material

A heating member for a fusing apparatus includes a resistive heating layer including a base polymer and an electroconductive filler dispersed in the base polymer, where the resistive heating layer generates heat by receiving electric energy, and where a storage modulus of the resistive heating layer is about 1.0 megapascal or greater.

Heating member and fusing apparatus including the same

A heating composite, including a polymer matrix; and a carbon nanotube structure including a plurality of carbon nanotubes continuously connected to each other and integrated with the polymer matrix.

Heating composite, and heating apparatus and fusing apparatus including the same

A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.

Resistance heating composition, heating composite using the composition, method of preparing the heating composite, and heating apparatus and fusing apparatus using the same

A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.

Resistance heating element and heating member and fusing device employing the same

A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.

Heating member including a base polymer and fusing apparatus including the same

A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.

Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member

A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.

Heating member and fusing device including the same

A field electron emitter including a metal electrode; and a plurality of carbon nanotubes, wherein a portion of the plurality of carbon nanotubes protrude from a surface of the metal electrode and a portion of the plurality of carbon nanotubes are in the metal electrode. Also disclosed is a field electron emission device including the field electron emitter and a method of manufacturing the field electron emitter.

Field electron emitter, field electron emission device including the same, and method of manufacturing the field electron emitter

A field emission device includes; a substrate including at least one groove, at least one metal electrode disposed respectively in the at least one groove, and carbon nanotube ('CNT') emitters disposed respectively on the at least one metal electrode, wherein each of the CNT emitters includes a composite of Sn and CNTs.

Field emission device and method of manufacturing the same

A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer. Accordingly, the characteristics of the soldering structure can be improved by involving the high reactive Zn to the interfacial reaction of the soldering.

Soldering structure and method using Zn

A field emission device includes a substrate including a groove; a metal electrode disposed on a bottom surface of the groove; and a carbon nanotube ('CNT') emitter. The CNT emitter includes an intermetallic compound layer disposed on the metal electrode and CNTs disposed on the intermetallic compound layer.

Field emission device

A field electron emitter includes a thin film layer including a carbon nanotube ('CNT') disposed on a substrate, wherein the thin film layer includes nucleic acid.

Field electron emitter including nucleic acid-coated carbon nanotube and method of manufacturing the same

Provided are a method of coating a catalyst metal layer by using a nucleic acid, and a method of forming nanocarbon using the method of coating a catalyst metal layer. The method of coating a catalyst metal layer includes preparing an aqueous solution; the aqueous solution including ions of a transition metal and a nucleic acid; disposing a carbon matrix including carbon, in the aqueous solution, and disposing a catalyst metal layer including a transition metal on a surface of the carbon matrix.

Growing community of inventors

Hwaseong-si, South Korea

Yoon-chul Son